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    ASSEMBLIES COMPRISING A THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILM, AN ELECTRODE AND AN ABSORBER LAYER, AND METHODS RELATING THERETO
    3.
    发明申请
    ASSEMBLIES COMPRISING A THERMALLY AND DIMENSIONALLY STABLE POLYIMIDE FILM, AN ELECTRODE AND AN ABSORBER LAYER, AND METHODS RELATING THERETO 审中-公开
    包含耐热和尺寸稳定的聚酰亚胺膜，电极和吸收层的组件以及与其相关的方法

    公开(公告)号：US20110220179A1

    公开(公告)日：2011-09-15

    申请号：US12883828

    申请日：2010-09-16

    申请人： Kostantinos KOURTAKIS ,  Brian C. AUMAN

    发明人： Kostantinos KOURTAKIS ,  Brian C. AUMAN

    IPC分类号： H01L31/042 ,  H01L31/0224

    CPC分类号： H01L31/032 ,  C08J5/18 ,  C08J2379/08 ,  C08L79/08 ,  H01L31/0322 ,  H01L31/0392 ,  H01L31/03925 ,  H01L31/03928 ,  Y02E10/541 ,  Y02P70/521

    摘要： The assemblies of the present disclosure comprise an electrode, and a polyimide film. The polyimide film contains from about 40 to about 95 weight percent of a polyimide derived from at least one aromatic dianhydride component, and at least one aromatic diamine component. The aromatic dianhydride and aromatic diamine component are selected from the group consisting of rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of A:B is 20-80:80-20. A is the mole percent of rigid rod dianhydride and rigid rod diamine, and B is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The polyimide films of the present disclosure further comprise a filler that is less than about 100 nanometers in all dimensions and is present in an amount from about 5 to about 60 weight percent of the total weight of the polyimide film.

    摘要翻译： 本公开的组件包括电极和聚酰亚胺膜。 聚酰亚胺膜含有约40至约95重量％的衍生自至少一种芳族二酐组分的聚酰亚胺和至少一种芳族二胺组分。 芳族二酐和芳族二胺组分选自刚性棒二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，A：B的比例为20-80：80-20。 A是刚性链二酸酐和刚性链二胺的摩尔百分数，B是非刚性棒二酐和非刚性棒二胺的摩尔百分数。 本公开的聚酰亚胺膜还包括在所有尺寸上小于约100纳米的填料，其量为聚酰亚胺膜的总重量的约5至约60重量％。

    THIN FILM TRANSISTOR COMPOSITIONS, AND METHODS RELATING THERETO
    5.
    发明申请
    THIN FILM TRANSISTOR COMPOSITIONS, AND METHODS RELATING THERETO 有权
    薄膜晶体管组合物及其相关方法

    公开(公告)号：US20110121296A1

    公开(公告)日：2011-05-26

    申请号：US12622789

    申请日：2009-11-20

    申请人： Brian C. Auman ,  Thomas Edward Carney

    发明人： Brian C. Auman ,  Thomas Edward Carney

    IPC分类号： H01L29/04 ,  H01L21/20

    CPC分类号： H01L21/02107 ,  C08G73/1067 ,  C09D179/08 ,  H01L27/1218 ,  H01L29/78603

    摘要： A process for forming at least one transistor on a substrate is described. The substrate comprises a polyimide and a nanoscopic filler. The polyimide is derived substantially or wholly from rigid rod monomers and the nanoscopic filler has an aspect ratio of at least 3:1. The substrates of the present disclosure are particularly well suited for thin film transistor applications, due at least in part to high resistance to hygroscopic expansion and relatively high levels of thermal and dimensional stability.

    摘要翻译： 描述了在衬底上形成至少一个晶体管的工艺。 衬底包括聚酰亚胺和纳米级填料。 聚酰亚胺基本上或全部来自刚性棒状单体，纳米尺寸填料的纵横比至少为3:1。 本公开的衬底特别适用于薄膜晶体管应用，至少部分地由于高吸湿膨胀性和相对较高水平的热和尺寸稳定性。

    Multi-functional circuitry substrates and compositions and methods relating thereto
    8.
    发明申请
    Multi-functional circuitry substrates and compositions and methods relating thereto 审中-公开
    多功能电路基板及其相关的组合物和方法

    公开(公告)号：US20080182115A1

    公开(公告)日：2008-07-31

    申请号：US11999664

    申请日：2007-12-06

    申请人： Gary C. Briney ,  Brian C. Auman ,  Christopher J. Milasincic

    发明人： Gary C. Briney ,  Brian C. Auman ,  Christopher J. Milasincic

    IPC分类号： B32B27/06

    CPC分类号： B32B27/34 ,  B32B27/20 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0269 ,  Y10T428/31504 ,  Y10T428/31721

    摘要： The invention is directed to substrates for electronic circuitry. The substrates of the invention have a first polyimide layer having a functional filler and a second polyimide layer having a functional filler. The first layer is non-identical to the second layer, and a surface of the first layer is in contact with and is directly bonded to a surface of the second layer. Filler from each layer extends into the interface between the two layers, and a plurality of covalent bonds are present between the first and second functional layers that chemically bond the two layers together to provide a reliable, predictable multifunctional substrate for electronic circuitry with improved performance relative to polyimide layers bonded together by an adhesive.

    摘要翻译： 本发明涉及电子电路用基板。 本发明的基板具有具有功能填料的第一聚酰亚胺层和具有功能性填料的第二聚酰亚胺层。 第一层与第二层不同，第一层的表面与第二层的表面接触并直接结合到第二层的表面。 来自每层的填料延伸到两层之间的界面中，并且多个共价键存在于第一和第二功能层之间，以将两层化学结合在一起，为电子电路提供可靠且可预测的多功能基板，具有改进的性能相对 通过粘合剂粘合在一起的聚酰亚胺层。