公开(公告)号：US20070251243A1

公开(公告)日：2007-11-01

申请号：US10939799

申请日：2004-09-13

申请人： John Geary ,  John Johnson ,  Len Ketelsen ,  David Lischner ,  Thomas Miller

发明人： John Geary ,  John Johnson ,  Len Ketelsen ,  David Lischner ,  Thomas Miller

IPC分类号： F25B21/02 ,  G05D23/30 ,  F25D23/12

CPC分类号： F25D19/006 ,  F25B21/02

摘要： Described is a thermally stabilized sensor for cooled component packages. A cooled component package includes a cooled component, a temperature-sensing device located adjacent to the cooled component, and a heat flow modifier located adjacent to the temperature-sensing device. Examples of the heat flow modifier include a ground shield, a wire bonded to platform upon which the cooled component is mounted, and a bonding layer between a refrigerator element and an optical subassembly that includes the cooled component.

摘要翻译： 描述了一种用于冷却组件封装的热稳定传感器。 冷却部件封装包括冷却部件，邻近冷却部件定位的温度感测装置和邻近温度感测装置定位的热流调节器。 热流量调节剂的实例包括接地屏蔽，接合到平台上的被冷却部件安装在其上的引线，以及包括冷却部件的冰箱元件和光学子组件之间的接合层。