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公开(公告)号：US4774871A
公开(公告)日：1988-10-04
申请号：US70309
申请日：1987-07-06
摘要： A braiding machine of the maypole form having co-acting horngear assemblies positioned in a cylindrical housing and arranged to drive spool carriers along a double undulating and intersecting drive track groove as groups in opposed directions. The form of the groove is such as to avoid discontinuities both in normal and in tangential components of acceleration forces on the spool carriers. Drive is transmitted from the horngear assemblies to the spool carriers by drive forks each carried on a pivot shaft mounted for oscillating rotation through restricted arc on the respective horngear assembly. Oscillating rotation of the drive forks is effected by a cam follower arrangement engaging a cam track such that the drive forks propel the spool carriers along the guide track groove with constant or substantially constant linear velocity.
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2.发明授权Automatic overlay measurements using an electronic beam system as a measurement tool 失效使用电子束系统作为测量工具的自动覆盖测量
公开(公告)号：US4149085A
公开(公告)日：1979-04-10
申请号：US869972
申请日：1978-01-16
IPC分类号： G01B15/00 , H01J37/304 , H01L21/027 , H01L21/302 , H01J37/00
CPC分类号： H01J37/3045
摘要： A method and apparatus is described for performing automatic overlay measurements on wafers utilized in semiconductor manufacturing. The overlay measurements are made at selected sites on a given wafer where a single bar pattern has been overlaid over a double bar pattern. The position of the single bar center line with respect to the center line between the double bars is a direct indication of the overlay error of the two patterns. The overlay error is measured in both the X and Y dimensions and is utilized to monitor the overlay error or to produce statistics and correlations to system parameters so that the sources of overlay errors may be identified and the errors eliminated or minimized on subsequent wafers being processed.
摘要翻译： 描述了一种在半导体制造中使用的晶片上进行自动重叠测量的方法和装置。 覆盖测量在给定晶片上的选定位置处进行，其中单个条形图案已经覆盖在双重条形图案上。 单条中心线相对于双杆之间的中心线的位置是两种图案的重叠误差的直接指示。 覆盖误差在X和Y维度上都被测量，并用于监测覆盖误差或产生与系统参数的统计学和相关性，从而可以识别覆盖误差的来源，并且在随后的晶片处理中消除或最小化误差 。
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