公开(公告)号：US06316954B1

公开(公告)日：2001-11-13

申请号：US09352797

申请日：1999-07-13

申请人： John T. Venaleck ,  John Tengler ,  Alan L. Roath

发明人： John T. Venaleck ,  John Tengler ,  Alan L. Roath

IPC分类号： G01R3102

CPC分类号： G01R31/2887 ,  G01R1/04 ,  G01R1/07378

摘要： A test interface is used to connect an electronic device under test (“DUT”), such as a computer chip, to a tester. The interface utilizes a combination of spring forces and air pressure forces to extend and retract pogo pins, respectively. The pogo pins when extended contact conductive pads which are electrically connected to the DUT, perhaps via a DUT board. Springs are biased to extend the pins to contact the pads, and air pressure is used to retract the pins. Thus no air pressure or vacuum is required to maintain the pins in contact with the pads. When retracted, the pogo pins are shielded from damage by a shield, such as a board with holes in it for the pogo pins to pass through.

摘要翻译： 测试接口用于将被测电子设备（“DUT”）如计算机芯片连接到测试仪。 该接口利用弹簧力和空气压力的组合分别延伸和缩回弹簧销。 当延伸的接触导体焊盘与DUT电连接时，可能通过DUT板进行弹簧引脚。 弹簧被偏压以延伸销以接触垫，并且使用空气压力来缩回销。 因此，不需要空气压力或真空来保持销与垫接触。 当收回时，弹簧销被屏蔽，防止其损坏，例如板上有孔，以便弹簧针穿过。

公开(公告)号：US4547028A

公开(公告)日：1985-10-15

申请号：US539121

申请日：1983-10-05

申请人： Thomas E. Morgan ,  John Tengler

发明人： Thomas E. Morgan ,  John Tengler

IPC分类号： G01R1/04 ,  H05K7/10 ,  H01R23/66

CPC分类号： H05K7/1038 ,  G01R1/0425 ,  Y10S439/912 ,  Y10T29/53257

摘要： The present invention is an electrical clip-like connector that has a low profile and is capable of connecting the conductors of an electrical cable, for example, with the leads of an integrated circuit package or the like. Due to the low profile configuration of the invention, it may be used in situ in confined environments, and it also may be used for coupling relatively high speed signals without or with minimum antenna effect. Other features of the invention include a locating mechanism that facilitates applying the clip connector to an integrated circuit assuring proper alignment of the contacts and leads and a preferred contact/support arrangement to help assure good electrical connection with the integrated circuit leads and tolerance for size and location errors while avoiding overstress damage to the contacts. Still other features of the invention include the close packing of the contacts thereof preferably in dual-in-line opposed contact pair arrangement, for example without having to spread the conductors of a ribbon cable connected thereto, the ability to ground or otherwise to connect in common certain ones of such conductors and/or contacts, and a resilient pivot mechanism for the connector body portions, which also preferably relies on the characteristics of the electrical cable to which the body portions are connected (preferably by direct molding thereto) to stabilize and to strengthen the connection between such body portions. The invention also includes a handle to install and to remove the clip-like connector with respect to an integrated circuit package or the like.

摘要翻译： 本发明是一种具有低外形并且能够将电缆的导体例如与集成电路封装等的引线连接的电夹式连接器。 由于本发明的薄型结构，其可以在有限的环境中原位使用，并且还可以用于耦合没有或具有最小天线效应的相对高速信号。 本发明的其它特征包括一种定位机构，其有利于将夹子连接器应用于集成电路，确保触点和引线的正确对准，以及优选的接触/支撑装置，以帮助确保与集成电路引线的良好电连接以及尺寸和 同时避免对触点的过应力损坏。 本发明的另外其它特征包括其触点的紧密封装优选为双列直线对置的接触对布置，例如不必扩展连接到其上的带状电缆的导体，接地或以其他方式连接的能力 这些导体和/或触点中的共同的某些，以及用于连接器主体部分的弹性枢转机构，其还优选地依赖于主体部分连接到其上的电缆的特性（优选地通过直接模制到其）来稳定和 以加强这种主体部分之间的连接。 本发明还包括一个手柄，用于相对于集成电路封装件等来安装和移除夹式连接器。