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公开(公告)号：US20190212368A1
公开(公告)日：2019-07-11
申请号：US16239553
申请日：2019-01-04
申请人： MPI Corporation
发明人： Hsien-Ta HSU , Yu-Chen HSU , Ching-Hua WU , Kuan-Chun CHOU , Horng-Kuang FAN
IPC分类号： G01R1/073
CPC分类号： G01R1/07378 , G01R1/07342
摘要： A probe card includes a space transformer, a printed circuit board and a plurality of welding elements. The space transformer is disposed with a plurality of first conductive protrusions. Each of the first conductive protrusions has a first end surface. The printed circuit board is disposed with a plurality of second conductive protrusions. Each of the second conductive protrusions has a second end surface. The welding elements are respectively and electrically connected between each of the second end surfaces and the corresponding first end surface. A first surface of the space transformer away from the printed circuit board has a first degree of flatness. A second surface of the printed circuit board away from the space transformer has a second degree of flatness. The first degree of flatness is less than the second degree of flatness.
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公开(公告)号：US10082525B2
公开(公告)日：2018-09-25
申请号：US15511733
申请日：2015-09-18
申请人： NHK Spring Co., Ltd.
发明人： Yoshio Yamada , Kohei Hironaka
CPC分类号： G01R1/07357 , G01N2201/00 , G01R1/06722 , G01R1/07378 , H01L21/00 , H01L2221/00 , H01R13/2421 , H01R2201/20
摘要： A probe unit according to the present invention is suitable for allowing a large current to flow. In the probe unit that accommodates a plurality of contact probes for electrically connecting an inspection target object and a signal processing device used to output an inspection signal, both ends of a large current probe (3) are electrically connected to electrodes of a contact target object, and a large current is made to flow via a metal block (50) that comes into contact with both end portions of the large current probe (3).
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公开(公告)号：US09921244B1
公开(公告)日：2018-03-20
申请号：US15414507
申请日：2017-01-24
发明人： Daniel Lam
CPC分类号： G01R1/07378 , G01R31/2834
摘要： Embodiments of the present utilize a specialized modular load board in combination with previously-tested daughter boards to yield a final design for generating a new printed circuit board (PCB) for testing. Since the electrical characteristics of the daughter board are already known by the client and well established during previous testing procedures, similar test programs can be used for production-level testing that were used in client prototyping processes that involved the use of the previously-tested daughter board. Thus, embodiments of the present disclosure can use the features of the specialized modular load board and a client's tested daughter board to develop more reliable, production-ready circuits.
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公开(公告)号：US20170322236A1
公开(公告)日：2017-11-09
申请号：US15524925
申请日：2014-11-26
发明人： Yuichi OZAWA , Yasuhito IGUCHI , Tetsuo YOSHIDA , Junzo KOSHIO
CPC分类号： G01R1/07378 , G01R31/2889
摘要： A wafer inspection method whereby inspection accuracy and operation efficiency is improved. A method for performing electrical inspection by bringing, at one time, a plurality of probes into contact with a plurality of pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads of the chips; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads for the purpose of recognizing the positional shifts of the pads due to thermal expansion when the wafer chuck is heated; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.
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公开(公告)号：US20170299631A1
公开(公告)日：2017-10-19
申请号：US15511733
申请日：2015-09-18
申请人： NHK Spring Co., Ltd.
发明人： Yoshio Yamada , Kohei Hironaka
CPC分类号： G01R1/07357 , G01N2201/00 , G01R1/06722 , G01R1/07378 , H01L21/00 , H01L2221/00 , H01R13/2421 , H01R2201/20
摘要： A probe unit according to the present invention is suitable for allowing a large current to flow. In the probe unit that accommodates a plurality of contact probes for electrically connecting an inspection target object and a signal processing device used to output an inspection signal, both ends of a large current probe (3) are electrically connected to electrodes of a contact target object, and a large current is made to flow via a metal block (50) that comes into contact with both end portions of the large current probe (3).
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公开(公告)号：US09759762B2
公开(公告)日：2017-09-12
申请号：US14781021
申请日：2014-03-18
CPC分类号： G01R31/26 , G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2887
摘要： A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other.
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公开(公告)号：US20170169931A1
公开(公告)日：2017-06-15
申请号：US15443653
申请日：2017-02-27
申请人： SEMCNS CO., LTD.
发明人： Yoon Hyuck CHOI , Kwang Jae OH , Ki Young KIM
CPC分类号： H01F27/2804 , G01R1/07378 , G01R31/26 , G01R31/2889 , H01F27/29 , H01F27/292
摘要： Disclosed herein is a pre space transformer including: a substrate having a first surface and a second surface, which is an opposite surface to the first surface; individual electrodes disposed on the first surface; and common electrodes disposed in the substrate, wherein the individual electrodes are repeatedly disposed while configuring a unit pattern.
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公开(公告)号：US09678149B2
公开(公告)日：2017-06-13
申请号：US14166296
申请日：2014-01-28
发明人： Bryan J. Root , William A. Funk
CPC分类号： G01R31/2889 , G01R1/07378 , G01R3/00 , G01R31/2886 , H05K1/117 , H05K3/325 , H05K2201/09027 , H05K2201/09063 , H05K2201/09227 , H05K2203/167 , Y10T29/49126 , Y10T29/49128
摘要： A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.
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公开(公告)号：US09671431B2
公开(公告)日：2017-06-06
申请号：US14003310
申请日：2011-04-28
申请人： Young Geun Park
发明人： Young Geun Park
CPC分类号： G01R1/07378 , G01R1/07342 , G01R3/00 , Y10T29/49124 , Y10T29/49128
摘要： There is provided a probe card in contact with pads formed on a plurality of semiconductor dies on a wafer to test the semiconductor dies. The probe card includes a printed circuit board on which a plurality of pads are formed; a block plate having a plurality of grooves and attached to the printed circuit board; a plurality of sub-probe units equipped with a plurality of probe tips in contact with the pads of the semiconductor dies and detachably coupled to the plurality of grooves; and a plurality of interposer/space transformer units interposed between the sub-probe units and the printed circuit board and configured to electrically connect the probe tips to the pads of the printed circuit board and transform a pitch of the pads formed on the printed circuit to a pitch of the plurality of probe tips.
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公开(公告)号：US20170115324A1
公开(公告)日：2017-04-27
申请号：US15317200
申请日：2015-06-04
申请人： OMRON Corporation
发明人： Hirotada TERANISHI , Takahiro SAKAI
IPC分类号： G01R1/067
CPC分类号： G01R1/06722 , G01R1/0483 , G01R1/067 , G01R1/06738 , G01R1/07342 , G01R1/0735 , G01R1/07378
摘要： A probe pin includes a coil spring, a first plunger, a first end of which is inserted from a first end of the coil spring into the coil spring and a second end of which is exposed to outside of the coil spring, and a second plunger, a first end of which is inserted from a second end of the coil spring into the coil spring to be in contact with the first end of the first plunger and a second end of which is exposed to the outside of the coil spring. The second plunger includes at least one elastic arm extending from the second end of the second plunger, and a touch portion is provided at a leading end of the elastic arm and displaceable in a direction intersecting an axial center direction when pressing force in the axial center direction is applied to the touch portion.
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