利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

7 条记录 (耗时 0.02 秒)

    Spring frame for protecting packaged electronic devices
    1.
    发明授权
    Spring frame for protecting packaged electronic devices 有权
    用于保护封装电子设备的弹簧框架

    公开(公告)号：US06417563B1

    公开(公告)日：2002-07-09

    申请号：US09617102

    申请日：2000-07-14

    申请人： Jonathan Halderman ,  Mohammad Khan ,  Alexander C. Tain ,  Tom Ley

    发明人： Jonathan Halderman ,  Mohammad Khan ,  Alexander C. Tain ,  Tom Ley

    IPC分类号： H05K720

    CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit arrangement comprising an integrated circuit package having a package board. An integrated circuit die is mounted to a surface of the package board. A spring frame is mounted to the package board surface at a pair of opposite frame bends. The spring frame has a central opening that receives the integrated circuit die. Sides of the spring frame away from the bends are raised from the package surface. A heat sink is mounted to the spring frame such that a bottom of the heat sink contacts an upper surface of the integrated circuit die as the heat sink pushes the sides of the spring frame toward the package surface.

    摘要翻译： 一种集成电路装置，包括具有封装板的集成电路封装。 集成电路管芯安装到封装板的表面。 弹簧框架以一对相对的框架弯曲部安装到封装板表面。 弹簧框架具有接收集成电路管芯的中心开口。 弹簧框架远离弯头的侧面从包装表面升高。 散热器安装到弹簧框架上，使得当散热器将弹簧框架的侧面朝向封装表面推动时，散热器的底部接触集成电路管芯的上表面。

    Method and apparatus for improved laser scribing of opto-electric devices
    3.
    发明授权
    Method and apparatus for improved laser scribing of opto-electric devices 有权
    光电装置激光划线方法及装置

    公开(公告)号：US08735772B2

    公开(公告)日：2014-05-27

    申请号：US13031232

    申请日：2011-02-20

    申请人： Juan Chacin ,  Irving Chyr ,  Jonathan Halderman

    发明人： Juan Chacin ,  Irving Chyr ,  Jonathan Halderman

    IPC分类号： B23K26/00 ,  H01L21/00

    CPC分类号： B23K26/364 ,  B23K26/035 ,  B23K26/0624 ,  B23K26/0853 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  H01S5/0201

    摘要： Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.

    摘要翻译： 公开了用于具有背面涂层的激光划片半导体衬底的激光划线系统。 特别地，这些激光划片系统激光刻划具有反射背面涂层的光电半导体晶片，以避免损坏光电装置，同时保持有效的制造。 更具体地说，这些激光划线系统在多次通过中在可见光区域和下方的波长处采用超快速脉冲激光器以去除背面涂层并刻划晶片。

    METHOD AND APPARATUS FOR IMPROVED LASER SCRIBING OF OPTO-ELECTRIC DEVICES
    4.
    发明申请
    METHOD AND APPARATUS FOR IMPROVED LASER SCRIBING OF OPTO-ELECTRIC DEVICES 有权
    用于改进光电装置的激光扫描的方法和装置

    公开(公告)号：US20120211477A1

    公开(公告)日：2012-08-23

    申请号：US13031232

    申请日：2011-02-20

    申请人： Juan Chacin ,  Irving Chyr ,  Jonathan Halderman

    发明人： Juan Chacin ,  Irving Chyr ,  Jonathan Halderman

    IPC分类号： B23K26/36 ,  B23K26/08

    CPC分类号： B23K26/364 ,  B23K26/035 ,  B23K26/0624 ,  B23K26/0853 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  H01S5/0201

    摘要： Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.

    摘要翻译： 公开了用于具有背面涂层的激光划片半导体衬底的激光划线系统。 特别地，这些激光划片系统激光刻划具有反射背面涂层的光电半导体晶片，以避免损坏光电装置，同时保持有效的制造。 更具体地说，这些激光划线系统在多次通过中在可见光区域和下方的波长处采用超快速脉冲激光器以去除背面涂层并刻划晶片。

    METHOD AND APPARATUS FOR IMPROVED SINGULATION OF LIGHT EMITTING DEVICES
    6.
    发明申请
    METHOD AND APPARATUS FOR IMPROVED SINGULATION OF LIGHT EMITTING DEVICES 审中-公开
    改进发光装置的方法和装置

    公开(公告)号：US20120175652A1

    公开(公告)日：2012-07-12

    申请号：US12985904

    申请日：2011-01-06

    申请人： Irving Chyr ,  Jonathan Halderman ,  Juan Chacin

    发明人： Irving Chyr ,  Jonathan Halderman ,  Juan Chacin

    IPC分类号： H01L33/22 ,  B23K26/00 ,  H01L21/268

    CPC分类号： B23K26/042 ,  B23K26/0624 ,  B23K26/083 ,  B23K26/142 ,  B23K26/355 ,  B23K26/359 ,  B23K26/40 ,  B23K2103/50 ,  H01L33/0095

    摘要： The present invention is a system and method for laser-assisted singulation of light emitting electronic devices manufactured on a substrate, having a processing surface and a depth extending from the processing surface. It includes providing a laser processing system having a picosecond laser having controllable parameters; controlling the laser parameters to form light pulses from the picosecond laser, to form a modified region having a depth which spans about 50% of the depth and substantially including the processing surface of the substrate and having a width less than about 5% of the region depth; and, singulating the substrate by applying mechanical stress to the substrate thereby cleaving the substrate into said light emitting electronic devices having sidewalls formed at least partially in cooperation with the linear modified regions.

    摘要翻译： 本发明是一种用于激光辅助单片化制造在基板上的发光电子装置的系统和方法，其具有从处理表面延伸的处理表面和深度。 它包括提供具有可控参数的皮秒激光的激光处理系统; 控制激光参数以形成来自皮秒激光的光脉冲，以形成具有跨越深度的约50％的深度并且基本上包括衬底的处理表面并且具有小于该区域的约5％的宽度的改变区域 深度; 以及通过对衬底施加机械应力，从而将衬底切割成具有至少部分地与线性改性区域配合的侧壁的所述发光电子器件，从而对衬底进行单片化。