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    Optical and electrical interconnect
    2.
    发明授权
    Optical and electrical interconnect 有权
    光电互连

    公开(公告)号：US07340120B2

    公开(公告)日：2008-03-04

    申请号：US11020985

    申请日：2004-12-22

    Applicant: Jonathan McFarland ,  Kannan Raj

    Inventor： Jonathan McFarland ,  Kannan Raj

    IPC: G02B6/12

    CPC classification number: G02B6/125 ,  G02B2006/12069

    Abstract: A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.

    Abstract translation: 制造互连的方法包括在载体基板上的各向异性导电膜中形成一个或多个孔，用能够传输光信号的材料填充一个或多个孔中的至少一个孔，并将各向异性导电膜层压在 包装基材。 电子封装包括第一衬底，第二衬底和位于第一衬底和第二衬底之间的互连。 互连包括用于将形成在第一衬底上的第一端子与形成在第二衬底上的第二端子电耦合的导电膜和嵌入导电膜中的一个或多个光学透射单元，其中一个或多个光学 透射单元在第一基板上的光学元件和第二基板上的光学元件之间提供光信号路径。

    Optical and electrical interconnect
    5.
    发明申请
    Optical and electrical interconnect 有权
    光电互连

    公开(公告)号：US20050104178A1

    公开(公告)日：2005-05-19

    申请号：US11020985

    申请日：2004-12-22

    Applicant: Jonathan McFarland ,  Kannan Raj

    Inventor： Jonathan McFarland ,  Kannan Raj

    IPC: G02B6/12 ,  G02B6/125 ,  H01L21/44 ,  H01L21/4763 ,  H01L23/02 ,  H01L29/40

    CPC classification number: G02B6/125 ,  G02B2006/12069

    Abstract: A method of fabricating an interconnect includes forming one or more holes in an anisotropic conductive film on a carrier substrate, filling at least one of the one or more holes with a material capable of transmitting an optical signal, and laminating the anisotropic conductive film on a packaging substrate. An electronic package includes a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect includes a conductive film for electrically coupling a first terminal formed on the first substrate to a second terminal formed on the second substrate, and one or more optically transmissive units embedded in the conductive film, wherein at least one of the one or more optically transmissive units provides an optical signal path between an optical element on the first substrate and an optical element on the second substrate.

    Abstract translation: 制造互连的方法包括在载体基板上的各向异性导电膜中形成一个或多个孔，用能够传输光信号的材料填充一个或多个孔中的至少一个孔，并将各向异性导电膜层压在 包装基材。 电子封装包括第一衬底，第二衬底和位于第一衬底和第二衬底之间的互连。 互连包括用于将形成在第一衬底上的第一端子与形成在第二衬底上的第二端子电耦合的导电膜和嵌入导电膜中的一个或多个光学透射单元，其中一个或多个光学 透射单元在第一基板上的光学元件和第二基板上的光学元件之间提供光信号路径。

    Optical and electrical interconnect
    6.
    发明授权
    Optical and electrical interconnect 有权
    光电互连

    公开(公告)号：US06847747B2

    公开(公告)日：2005-01-25

    申请号：US09846032

    申请日：2001-04-30

    Applicant: Jonathan McFarland ,  Kannan Raj

    Inventor： Jonathan McFarland ,  Kannan Raj

    IPC: G02B6/12 ,  G02B6/125

    CPC classification number: G02B6/125 ,  G02B2006/12069

    Abstract: An interconnect comprising an anisotropic conductive film and an optically transmissive unit embedded in the anisotropic conductive film. The optically transmissive unit provides an optically transmissive path through the anisotropic conductive film. In an alternative embodiment, an electronic package comprises a first substrate, a second substrate, and an interconnect located between the first substrate and the second substrate. The interconnect comprises an anisotropic conductive film for electrically coupling a first conductive element formed on the first substrate to a second conductive element formed on the second substrate and one or more optically transmissive units embedded in the anisotropic conductive film. At least one of the one or more optically transmissive units couples an optical signal path on the first substrate to an optical receiver on the second substrate.

    Abstract translation: 包括各向异性导电膜和嵌入各向异性导电膜中的光学透射单元的互连。 光学透射单元提供穿过各向异性导电膜的光学透射路径。 在替代实施例中，电子封装包括第一衬底，第二衬底和位于第一衬底和第二衬底之间的互连。 互连包括用于将形成在第一衬底上的第一导电元件电耦合到形成在第二衬底上的第二导电元件和嵌入各向异性导电膜中的一个或多个光学透射单元的各向异性导电膜。 一个或多个光学透射单元中的至少一个将第一基板上的光信号路径耦合到第二基板上的光接收器。

    Echelle grating with cyclic free-spectral range
    7.
    发明授权
    Echelle grating with cyclic free-spectral range 有权
    具有循环自由光谱范围的Echelle光栅

    公开(公告)号：US08873961B2

    公开(公告)日：2014-10-28

    申请号：US13205879

    申请日：2011-08-09

    Applicant: Ying Luo ,  Xuezhe Zheng ,  Guoliang Li ,  Kannan Raj ,  Ashok V. Krishnamoorthy

    Inventor： Ying Luo ,  Xuezhe Zheng ,  Guoliang Li ,  Kannan Raj ,  Ashok V. Krishnamoorthy

    IPC: H04J14/02 ,  G02B6/293

    CPC classification number: H04J14/02 ,  G02B6/29308 ,  G02B6/2931

    Abstract: An optical de-multiplexer (de-MUX) that includes an optical device that images and diffracts an optical signal using a reflective geometry is described, where a free spectral range (FSR) of the optical device associated with a given diffraction order abuts FSRs associated with adjacent diffraction orders. Moreover, the channel spacings within diffraction orders and between adjacent diffraction orders are equal to the predefined channel spacing associated with the optical signal. As a consequence, the optical device has a comb-filter output spectrum, which reduces a tuning energy of the optical device by eliminating spectral gaps between diffraction orders of the optical device.

    Abstract translation: 描述了包括使用反射几何形状对光信号进行成像和衍射的光学装置的光学去多路复用器（de-MUX），其中与给定衍射级相关联的光学装置的自由光谱范围（FSR）与相关联的FSR相邻 具有相邻衍射级。 此外，衍射级之间和相邻衍射级之间的沟道间隔等于与光信号相关联的预定的沟道间隔。 因此，光学器件具有梳状滤波器输出光谱，其通过消除光学器件的衍射级之间的光谱间隙来减少光学器件的调谐能量。

    Direct interlayer optical coupler
    8.
    发明授权
    Direct interlayer optical coupler 有权
    直接层间光耦合器

    公开(公告)号：US08548287B2

    公开(公告)日：2013-10-01

    申请号：US13293624

    申请日：2011-11-10

    Applicant: Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    Inventor： Hiren D. Thacker ,  Xuezhe Zheng ,  Ivan Shubin ,  Kannan Raj ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

    IPC: G02B6/12

    CPC classification number: G02B6/26 ,  Y10T29/49826

    Abstract: In an MCM, an optical signal is conveyed by an optical waveguide disposed on a surface of a first substrate to an optical coupler having a vertical facet. This optical coupler has an optical mode that is different than the optical mode of the optical waveguide. For example, the spatial extent of the optical mode associated with the optical coupler may be larger, thereby reducing optical losses and sensitivity to alignment errors. Then, the optical signal is directly coupled from the vertical facet to a facing vertical facet of an identical optical coupler on another substrate, and the optical signal is conveyed in another optical waveguide disposed on the other substrate.

    Abstract translation: 在MCM中，光信号由设置在第一基板的表面上的光波导传送到具有垂直面的光耦合器。 该光耦合器具有与光波导的光学模式不同的光学模式。 例如，与光耦合器相关联的光学模式的空间范围可能更大，从而减少光学损耗和对准误差的灵敏度。 然后，光信号从另一基板上的垂直面到同一光耦合器的面向垂直面直接耦合，并且光信号在设置在另一基板上的另一光波导中传送。

    CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS
    9.
    发明申请
    CHIP ASSEMBLY CONFIGURATION WITH DENSELY PACKED OPTICAL INTERCONNECTS 审中-公开
    芯片组件配置与密封包装光学互连

    公开(公告)号：US20130230272A1

    公开(公告)日：2013-09-05

    申请号：US13410113

    申请日：2012-03-01

    Applicant: Kannan Raj ,  Dawei Huang ,  Nicholas E. Aneshansley ,  Theresa Sze ,  David K. McElfresh

    Inventor： Kannan Raj ,  Dawei Huang ,  Nicholas E. Aneshansley ,  Theresa Sze ,  David K. McElfresh

    IPC: G02B6/12

    CPC classification number: G02B6/428 ,  G02B6/4246 ,  G02B6/4269 ,  G02B6/4274

    Abstract: A chip assembly configuration includes an substrate with an integrated circuit on one side and a conversion mechanism on the other side. The integrated circuit and the conversion mechanism are electrically coupled by a short electrical transmission line through the substrate. Moreover, the conversion mechanism converts signals between an electrical and an optical domain, thereby allowing high-speed communication between the integrated circuit and other components and devices using optical communication (for example, in an optical fiber or an optical waveguide).

    Abstract translation: 芯片组装配置包括在一侧具有集成电路的基板和另一侧上的转换机构。 集成电路和转换机构通过穿过衬底的短电传输线电耦合。 此外，转换机构在电区域和光学域之间转换信号，从而允许集成电路与使用光通信的其他部件和设备（例如，在光纤或光波导中）之间的高速通信。

    ECHELLE GRATING WITH CYCLIC FREE-SPECTRAL RANGE
    10.
    发明申请
    ECHELLE GRATING WITH CYCLIC FREE-SPECTRAL RANGE 有权

    公开(公告)号：US20130039661A1

    公开(公告)日：2013-02-14

    申请号：US13205879

    申请日：2011-08-09

    Applicant: Ying Luo ,  Xuezhe Zheng ,  Guoliang Li ,  Kannan Raj ,  Ashok V. Krishnamoorthy

    Inventor： Ying Luo ,  Xuezhe Zheng ,  Guoliang Li ,  Kannan Raj ,  Ashok V. Krishnamoorthy

    IPC: H04J14/02 ,  G02B5/18

    CPC classification number: H04J14/02 ,  G02B6/29308 ,  G02B6/2931

    Abstract: An optical de-multiplexer (de-MUX) that includes an optical device that images and diffracts an optical signal using a reflective geometry is described, where a free spectral range (FSR) of the optical device associated with a given diffraction order abuts FSRs associated with adjacent diffraction orders. Moreover, the channel spacings within diffraction orders and between adjacent diffraction orders are equal to the predefined channel spacing associated with the optical signal. As a consequence, the optical device has a comb-filter output spectrum, which reduces a tuning energy of the optical device by eliminating spectral gaps between diffraction orders of the optical device.

    Abstract translation: 描述了包括使用反射几何形状对光信号进行成像和衍射的光学装置的光学去多路复用器（de-MUX），其中与给定衍射级相关联的光学装置的自由光谱范围（FSR）与相关联的FSR相邻 具有相邻衍射级。 此外，衍射级之间和相邻衍射级之间的沟道间隔等于与光信号相关联的预定通道间隔。 因此，光学器件具有梳状滤波器输出光谱，其通过消除光学器件的衍射级之间的光谱间隙来减少光学器件的调谐能量。

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