公开(公告)号：US20120206219A1

公开(公告)日：2012-08-16

申请号：US13360183

申请日：2012-01-27

申请人： Joo-Young CHOI ,  Stefan Koch ,  Thomas Merkle

发明人： Joo-Young CHOI ,  Stefan Koch ,  Thomas Merkle

IPC分类号： H01P7/06 ,  H01P5/103

CPC分类号： H01P5/107

摘要： The present invention relates to a feeding structure for coupling a feedline to a cavity. To increase the coupling, which can contribute to achieving a broad bandwidth, a feeding structure is proposed comprising a carrier substrate, a top conductor plane of a cavity formed in said carrier substrate, a feedline substrate covering said top conductor plane, a signal conductor of a feedline, said signal conductor being formed in or on said feedline substrate opposite said top conductor plane, a via probe connected to said signal conductor and leading through said feedline substrate and said top conductor plane into said cavity, a ring-shaped aperture formed in said top conductor plane around said via probe, and at least one slot-shaped aperture formed in said top conductor plane starting at said ring-shaped aperture and leading away from said via probe.

摘要翻译： 本发明涉及用于将馈线连接到空腔的馈送结构。 为了增加有助于实现宽带宽的耦合，提出了一种馈电结构，其包括载体衬底，形成在所述载体衬底中的空腔的顶部导体平面，覆盖所述顶部导体平面的馈线衬底， 馈线，所述信号导体形成在与所述顶导体平面相对的所述馈线衬底中或上，所述信号导体连接到所述信号导体并通过所述馈线衬底和所述顶导体平面进入所述空腔中的通孔探针， 围绕所述通孔探针的所述顶部导体平面以及形成在所述顶部导体平面中的至少一个狭槽形孔，从所述环形孔开始并远离所述通孔探针。

公开(公告)号：US20110084406A1

公开(公告)日：2011-04-14

申请号：US12896375

申请日：2010-10-01

申请人： Joo-Young CHOI ,  Stefan Koch

发明人： Joo-Young CHOI ,  Stefan Koch

IPC分类号： H01L23/48

CPC分类号： H01G2/065 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2224/16265 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19032 ,  H01L2924/19104 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： The present invention discloses a device in flip chip architecture. The device comprises at least two integrated circuits, which are interconnected by a passive device. The integrated circuits are mounted on a base ground plate, and are each connected to the passive device via conductive elements.For the interconnection of the integrated circuits with the passive device, the device employs the structure of an inverted microstrip line, a suspended microstrip line, a covered microstrip line or a conventional microstrip line.Depending on the interconnection scheme, low transmission loss, low susceptibility to external interferences, easy alignment properties in the assembly process, a compact package size, a high reproducibility and/or low cost can be achieved.

摘要翻译： 本发明公开了一种倒装芯片架构的器件。 该装置包括由无源装置互连的至少两个集成电路。 集成电路安装在基座接地板上，并通过导电元件连接到无源器件。 对于集成电路与无源器件的互连，器件采用反相微带线，悬浮微带线，覆盖微带线或常规微带线的结构。 根据互连方案，低传输损耗，对外部干扰的敏感性低，组装过程中易于对准的特性，可以实现紧凑的封装尺寸，高重现性和/或低成本。