摘要:
The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.
摘要:
A feeding structure including a carrier substrate, a top conductor plane of a cavity formed in the carrier substrate, a feedline substrate covering the top conductor plane, a signal conductor of a feedline, the signal conductor being formed in or on the feedline substrate opposite the top conductor plane, a via probe connected to the signal conductor and leading through the feedline substrate and the top conductor plane into the cavity, a ring-shaped aperture formed in the top conductor plane around the via probe, and at least one slot-shaped aperture formed in the top conductor plane starting at the ring-shaped aperture and leading away from the via probe.
摘要:
The present invention relates to a feeding structure for coupling a feedline to a cavity. To increase the coupling, which can contribute to achieving a broad bandwidth, a feeding structure is proposed comprising a carrier substrate, a top conductor plane of a cavity formed in said carrier substrate, a feedline substrate covering said top conductor plane, a signal conductor of a feedline, said signal conductor being formed in or on said feedline substrate opposite said top conductor plane, a via probe connected to said signal conductor and leading through said feedline substrate and said top conductor plane into said cavity, a ring-shaped aperture formed in said top conductor plane around said via probe, and at least one slot-shaped aperture formed in said top conductor plane starting at said ring-shaped aperture and leading away from said via probe.
摘要:
The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.
摘要:
The present invention provides a space saving and simply implementable planar integrated switching device comprising at least two CPW-slotline transition units each including an access for inputting and/or outputting a transmission signal, a slotline connecting said at least two CPW-slotline transition units, and a switching element arranged on said slotline between said at least two CPW-slotline transition units for switching the transmission signal over said slotline on and off under control of a switch control signal.
摘要:
The present invention provides a space saving and simply implementable planar integrated switching device comprising at least two CPW-slotline transition units each including an access for inputting and/or outputting a transmission signal, a slotline connecting said at least two CPW-slotline transition units, and a switching element arranged on said slotline between said at least two CPW-slotline transition units for switching the transmission signal over said slotline on and off under control of a switch control signal.
摘要:
The present invention discloses a device in flip chip architecture. The device comprises at least two integrated circuits, which are interconnected by a passive device. The integrated circuits are mounted on a base ground plate, and are each connected to the passive device via conductive elements.For the interconnection of the integrated circuits with the passive device, the device employs the structure of an inverted microstrip line, a suspended microstrip line, a covered microstrip line or a conventional microstrip line.Depending on the interconnection scheme, low transmission loss, low susceptibility to external interferences, easy alignment properties in the assembly process, a compact package size, a high reproducibility and/or low cost can be achieved.
摘要:
A test method for testing elongated objects comprising moving an elongated object in a feed-through direction through a feed-through coil arrangement having at least one feed-through coil, wherein the feed-through coil arrangement is secured to be transversely movable with respect to the feed-through direction of the object and is guided on the object passing through such that the feed-through coil arrangement can follow transverse movements of the object occurring transversely with respect to the feed-through direction of the object.
摘要:
The invention relates to an activation apparatus (20) for a galvanically decoupled direct voltage converter having a synchronous rectifier, comprising a signal generating device (22), which is designed to generate control signals (22c, 22d) for switch devices of the synchronous rectifier and a reference current signal (22b), a first comparator device (23), which is coupled to the signal generating device (22), and which is designed to detect the secondary-side output current (Jo) of the synchronous rectifier, compare it to the reference current signal (22b) and generate a current control signal in dependence on the comparison, and a pulse width modulation device (25), which is coupled to the signal generating device (22) and the first comparator device (23) and which is designed to generate pulse width modulated activation signals (25a) for the switch devices of the synchronous rectifier on the basis of the control signals (22c, 22d) and the current control signal, wherein the signal generating device (22) is furthermore designed to reduce the reference current signal (22b) within a first predetermined timespan to a predetermined reference current threshold.
摘要:
An apparatus for demodulating an input signal that includes a frequency detector for tracking a frequency of the input signal, an oscillator and a mixer is disclosed. The input signal and an output signal of the oscillator can constitute the incoming signals for the mixer and the output signal of the mixer can constitute the demodulated input signal, wherein an arithmetic unit is arranged downstream of the frequency detector and upstream of the oscillator, wherein the tracked frequency of the input signal and a predefined second frequency constitute the incoming signals of the arithmetic unit and the arithmetic unit is designed such that it computes a control signal for the oscillator from the tracked frequency of the input signal and the predefined second frequency with the output signal of the oscillator depending on the control signal.