公开(公告)号：US09398694B2

公开(公告)日：2016-07-19

申请号：US13348295

申请日：2012-01-11

申请人： Thomas Merkle ,  Stefan Koch ,  Joo-Young Choi

发明人： Thomas Merkle ,  Stefan Koch ,  Joo-Young Choi

IPC分类号： H01L25/00 ,  H05K1/18 ,  H05K1/02 ,  H01L23/66 ,  H01L25/16 ,  H01L23/538 ,  H05K1/16 ,  H01L23/498

CPC分类号： H05K3/4697 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/16 ,  H05K1/185 ,  H05K3/301 ,  H05K3/465 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2203/1469 ,  H01L2924/00

摘要： The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

摘要翻译： 本发明涉及以毫米波和太赫兹频率工作的集成电子系统的领域。 提出了一种单片多芯片封装，这种封装的载体结构以及用于制造这种封装和这种载体结构的制造方法，以获得完全屏蔽mm波/ THz系统的不同功能的封装。 通过聚合光敏单体将包装倒入适当位置。 它逐渐在MMIC（单片微波集成电路）之上和之上增长，连接到MMIC，但使芯片的高频区域变得困难。 所提出的方法导致电磁完全屏蔽的功能块。 这些单元可以根据系统需要进行组合和级联。

公开(公告)号：US08884716B2

公开(公告)日：2014-11-11

申请号：US13360183

申请日：2012-01-27

申请人： Joo-Young Choi ,  Stefan Koch ,  Thomas Merkle

发明人： Joo-Young Choi ,  Stefan Koch ,  Thomas Merkle

IPC分类号： H01P5/107

CPC分类号： H01P5/107

摘要： A feeding structure including a carrier substrate, a top conductor plane of a cavity formed in the carrier substrate, a feedline substrate covering the top conductor plane, a signal conductor of a feedline, the signal conductor being formed in or on the feedline substrate opposite the top conductor plane, a via probe connected to the signal conductor and leading through the feedline substrate and the top conductor plane into the cavity, a ring-shaped aperture formed in the top conductor plane around the via probe, and at least one slot-shaped aperture formed in the top conductor plane starting at the ring-shaped aperture and leading away from the via probe.

摘要翻译： 一种馈送结构，包括载体衬底，形成在载体衬底中的空腔的顶部导体平面，覆盖顶部导体平面的馈线衬底，馈线的信号导体，信号导体形成在馈线衬底上或与衬底相对的馈线衬底上 顶导体平面，连接到信号导体并通过馈线基板并且顶部导体平面进入空腔的通孔探针，形成在通孔探针周围的顶部导体平面中的环形孔，以及至少一个槽形 孔形成在顶部导体平面中，从环形孔开始并远离通孔探针。

公开(公告)号：US20120206219A1

公开(公告)日：2012-08-16

申请号：US13360183

申请日：2012-01-27

申请人： Joo-Young CHOI ,  Stefan Koch ,  Thomas Merkle

发明人： Joo-Young CHOI ,  Stefan Koch ,  Thomas Merkle

IPC分类号： H01P7/06 ,  H01P5/103

CPC分类号： H01P5/107

摘要： The present invention relates to a feeding structure for coupling a feedline to a cavity. To increase the coupling, which can contribute to achieving a broad bandwidth, a feeding structure is proposed comprising a carrier substrate, a top conductor plane of a cavity formed in said carrier substrate, a feedline substrate covering said top conductor plane, a signal conductor of a feedline, said signal conductor being formed in or on said feedline substrate opposite said top conductor plane, a via probe connected to said signal conductor and leading through said feedline substrate and said top conductor plane into said cavity, a ring-shaped aperture formed in said top conductor plane around said via probe, and at least one slot-shaped aperture formed in said top conductor plane starting at said ring-shaped aperture and leading away from said via probe.

摘要翻译： 本发明涉及用于将馈线连接到空腔的馈送结构。 为了增加有助于实现宽带宽的耦合，提出了一种馈电结构，其包括载体衬底，形成在所述载体衬底中的空腔的顶部导体平面，覆盖所述顶部导体平面的馈线衬底， 馈线，所述信号导体形成在与所述顶导体平面相对的所述馈线衬底中或上，所述信号导体连接到所述信号导体并通过所述馈线衬底和所述顶导体平面进入所述空腔中的通孔探针， 围绕所述通孔探针的所述顶部导体平面以及形成在所述顶部导体平面中的至少一个狭槽形孔，从所述环形孔开始并远离所述通孔探针。

公开(公告)号：US20120182066A1

公开(公告)日：2012-07-19

申请号：US13348295

申请日：2012-01-11

申请人： Thomas MERKLE ,  Stefan Koch ,  Joo-Young Choi

发明人： Thomas MERKLE ,  Stefan Koch ,  Joo-Young Choi

IPC分类号： H01L25/00 ,  H05K1/02 ,  H05K13/00 ,  H01L21/56

CPC分类号： H05K3/4697 ,  H01L23/49827 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/16 ,  H05K1/185 ,  H05K3/301 ,  H05K3/465 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/09981 ,  H05K2203/1469 ,  H01L2924/00

摘要： The present invention relates to the field of integrating electronic systems that operate at mm-wave and THz frequencies. A monolithic multichip package, a carrier structure for such a package as well as manufacturing methods for manufacturing such a package and such a carrier structure are proposed to obtain a package that fully shields different functions of the mm-wave/THz system. The package is poured into place by polymerizing photo sensitive monomers. It gradually grows around and above the MMICs (Monolithically Microwave Integrated Circuit) making connection to the MMICs but recessing the high frequency areas of the chip. The proposed approach leads to functional blocks that are electromagnetically completely shielded. These units can be combined and cascaded according to system needs.

摘要翻译： 本发明涉及以毫米波和太赫兹频率工作的集成电子系统的领域。 提出了一种单片多芯片封装，这种封装的载体结构以及用于制造这种封装和这种载体结构的制造方法，以获得完全屏蔽mm波/ THz系统的不同功能的封装。 通过聚合光敏单体将包装倒入适当位置。 它逐渐在MMIC（单片微波集成电路）之上和之上增长，连接到MMIC，但使芯片的高频区域变得困难。 所提出的方法导致电磁完全屏蔽的功能块。 这些单元可以根据系统需要进行组合和级联。