摘要:
A tiled detector assembly (1000) and a method for making a tiled radiation detector (1000) is described. The innovative feature of this method is that the xyz misalignment of the detector tiles (304, 304′), the origin of various image artifacts, can be significantly reduced by accurate sizing and alignment of the detector tiles (304, 304′). Consequently, image quality, yield and reliability of as-produced tiled radiation detectors are considerably improved.
摘要:
A tiled detector assembly (1000) and a method for making a tiled radiation detector (1000) is described. The innovative feature of this method is that the xyz misalignment of the detector tiles (304, 304′), the origin of various image artifacts, can be significantly reduced by accurate sizing and alignment of the detector tiles (304, 304′). Consequently, image quality, yield and reliability of as-produced tiled radiation detectors are considerably improved.
摘要:
An electronic device includes an electronic component 2, 3, such as a SAW (=Surface Acoustic Wave) filter 2, 3 having connection areas 4, 5. The filter 2, 3 is sealed off from the environment by means of a cover 6 forming a cavity 7 above the filter 2, 3. According to the invention, the cover 6 is formed by a lacquer layer 6A which is provided, at the location of the filter 2, 3, with an opening 7′ and which is covered with a photoresist layer 6B closing the opening 7′ such that the cavity 7 thus formed has a thickness above zero everywhere above the filter 2, 3. This enables an accurate and stable frequency selection by means of the filter 2, 3 and allows the device according to the invention to be very compact and easy to manufacture. Thus, the device according to the invention is very suitable for use in an application such as a mobile telephone, also after integration of the device with a semiconductor device. The photoresist layer 6B and the lacquer layer 6A preferably contain further openings 8, at the location of the connection regions 4, 5, which are provided with bumps 9, preferably solder bumps 9. Preferably, the photoresist layer 6B includes a solid foil 6B, which is solder-repellent.