公开(公告)号：US12081193B2

公开(公告)日：2024-09-03

申请号：US18243201

申请日：2023-09-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koichiro Kawasaki

IPC: H03H9/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/25

CPC classification number: H03H9/1092 ,  H03H9/059 ,  H03H9/25

Abstract: An acoustic wave device includes a piezoelectric substrate, functional elements, an outer peripheral support layer, a cover portion, and a protective layer covering the cover portion. A hollow space is defined by the piezoelectric substrate, the outer peripheral support layer, and the cover portion, and the functional elements are disposed in the hollow space. The acoustic wave device further includes an under bump metal layer, a wiring pattern, and a through-electrode that connects these elements. In the protective layer, a through-hole to be filled with a conductor to electrically connect a solder ball and the under bump metal layer is provided. The outer peripheral support layer includes a protruding portion protruding to the hollow space. When the acoustic wave device is seen in plan view, at least a portion of the through-hole overlaps the hollow space, and an end portion of the protruding portion overlaps an inner region of the through-hole.

公开(公告)号：US20240213958A1

公开(公告)日：2024-06-27

申请号：US18069958

申请日：2022-12-21

Applicant: RF360 EUROPE GMBH

Inventor： Stefan AMMANN ,  Matthias PERNPEINTNER ,  Manuel HOFER ,  Stefan Leopold HATZL

IPC: H03H9/64 ,  H03H3/08 ,  H03H9/10 ,  H03H9/145 ,  H03H9/25

CPC classification number: H03H9/6483 ,  H03H3/08 ,  H03H9/1092 ,  H03H9/145 ,  H03H9/25

Abstract: Aspects of the disclosure relate to devices, wireless communication apparatuses, methods, and circuitry implementing filters with electroacoustic vertical coupling. One aspect is a filter comprising a piezoelectric substrate having a first piezoelectric surface and a second piezoelectric surface opposite the first piezoelectric surface. The filter further comprises a first electroacoustic resonator comprising a first interdigital transducer (IDT) disposed on or over the first piezoelectric surface of the piezoelectric substrate and a second electroacoustic resonator comprising a second IDT disposed on or over the second piezoelectric surface of the piezoelectric substrate. The second electroacoustic resonator is electrically coupled to the first electroacoustic resonator in series or in parallel.

公开(公告)号：US20240063774A1

公开(公告)日：2024-02-22

申请号：US18499222

申请日：2023-11-01

Applicant: United Microelectronics Corp.

Inventor： Chen-Hsiao Wang ,  Kai-Kuang Ho

IPC: H03H9/10 ,  H03H3/08 ,  H03H9/25 ,  H03H9/02 ,  H10N30/02 ,  H10N30/88

CPC classification number: H03H9/1092 ,  H03H3/08 ,  H03H9/25 ,  H03H9/02937 ,  H10N30/02 ,  H10N30/883 ,  Y10T29/49005 ,  Y10T29/42

Abstract: A surface acoustic wave (SAW) device including a substrate is provided. Multiple surface acoustic wave elements are disposed on the substrate. A conductive surrounding structure includes: a wall part, disposed on the substrate and surrounding the surface acoustic wave elements; and a lateral layer part, disposed on the wall part. The lateral layer part has an opening above the surface acoustic wave elements. A cap layer covers the lateral layer part and closes the opening.

公开(公告)号：US20240063773A1

公开(公告)日：2024-02-22

申请号：US18234832

申请日：2023-08-16

Applicant: Skyworks Solutions, Inc.

Inventor： Hironori Fukuhara ,  Rei Goto

IPC: H03H9/10 ,  H03H3/08 ,  H03H9/02

CPC classification number: H03H9/1092 ,  H03H3/08 ,  H03H9/02834 ,  H03H9/02897

Abstract: A surface acoustic wave filter package includes a cavity formed in or above a substrate and one or more surface acoustic wave filters formed on the substrate. The surface acoustic wave filter package includes a cavity roof including a filler material and having a low coefficient of thermal expansion.

公开(公告)号：US11894824B2

公开(公告)日：2024-02-06

申请号：US16555860

申请日：2019-08-29

Applicant: Skyworks Solutions, Inc.

Inventor： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC: H03H9/02 ,  H03H3/08 ,  B23K26/362 ,  H03H9/10 ,  H03H9/25 ,  H03H9/05

CPC classification number: H03H3/08 ,  B23K26/362 ,  H03H9/02559 ,  H03H9/02622 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1092 ,  H03H9/25 ,  G01N2291/0423 ,  H01L2224/16

Abstract: Laser-marked packaged surface acoustic wave devices are provided. The laser-marked packaged surface acoustic wave device may include a package structure encapsulating a surface acoustic wave device on a first side of a piezoelectric substrate. The opposite side of the piezoelectric substrate can be directly marked using a laser. The laser may be a deep ultraviolet laser. By directly marking the piezoelectric substrate itself, the use of a separate marking film can be avoided, making the packaged surface acoustic wave device thinner. When the laser has a wavelength readily absorbed by the piezoelectric substrate, a relatively shallow marking may be made in the piezoelectric substrate. The markings can extend less than 1 micrometer into the piezoelectric substrate, so as not to affect the structural integrity of the piezoelectric substrate or the operation of the packaged surface acoustic wave device.

公开(公告)号：US11831300B2

公开(公告)日：2023-11-28

申请号：US16815097

申请日：2020-03-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Koichiro Kawasaki ,  Taku Kikuchi

IPC: H03H9/64 ,  H03H9/02 ,  H03H9/25 ,  H03H9/10 ,  H01L23/12

CPC classification number: H03H9/64 ,  H01L23/12 ,  H03H9/02834 ,  H03H9/02944 ,  H03H9/02992 ,  H03H9/1092 ,  H03H9/25 ,  H01L2224/14 ,  H01L2224/16227 ,  H01L2924/16235

Abstract: An elastic wave filter apparatus includes at least one excitation electrode, a first electrode land, and second electrode lands provided on a first main surface of a device substrate including a piezoelectric layer. A signal terminal and metal members are provided on a second main surface of the device substrate. The first electrode land and the signal terminal are connected to a signal potential, and the second electrode lands and the metal members are connected to a ground potential. A first connection electrode connects the first electrode land and the signal terminal, and a second connection electrode connects at least one of the second electrode lands and at least one of the metal members. The at least one metal member connected to the second connection electrode overlaps at least a portion of the at least one excitation electrode across the device substrate.

公开(公告)号：US20230336145A1

公开(公告)日：2023-10-19

申请号：US18131913

申请日：2023-04-07

Applicant: SKYWORKS SOLUTIONS, INC.

Inventor： Rei Goto ,  Hironori Fukuhara

IPC: H03H9/02 ,  H03H3/08 ,  H03H9/10

CPC classification number: H03H9/02834 ,  H03H3/08 ,  H03H9/02897 ,  H03H9/1092

Abstract: Disclosed is a packaged acoustic wave component and a method for making a packaged acoustic wave component. The packaged acoustic wave component comprises a substrate, a dielectric layer disposed over the substrate, a piezoelectric structure disposed over the dielectric layer, an electrode structure disposed over the piezoelectric structure, a polymer structure including a polymer structure wall portion and a polymer structure roof portion configured to form a cavity over the electrode structure, a metal structure disposed over the polymer structure, and a buffer coating disposed over the metal structure. The polymer structure includes a polymer structure lateral portion sandwiched between the substrate, the dielectric layer, or the piezoelectric structure on one side, and both the metal structure and the buffer coating on the other side.

公开(公告)号：US11777465B2

公开(公告)日：2023-10-03

申请号：US16555904

申请日：2019-08-29

Applicant: Skyworks Solutions, Inc.

Inventor： Li Ann Koo ,  Takashi Inoue ,  Vivian Sing Zhi Lee ,  Ping Yi Tan

IPC: H03H9/25 ,  H03H3/08 ,  H03H9/02 ,  B23K26/362 ,  H03H9/10 ,  H03H9/05

CPC classification number: H03H3/08 ,  B23K26/362 ,  H03H9/02559 ,  H03H9/02622 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1092 ,  H03H9/25 ,  G01N2291/0423 ,  H01L2224/16

Abstract: Packaged surface acoustic wave devices are provided. The packaged surface acoustic wave devices are relatively thin and can have a height of less than 220 micrometers. The packaged surface acoustic wave device includes a photosensitive resin over a conductive structure which may be formed by a plating process. The conductive structure may overlie a cavity-defining structure encapsulating a surface acoustic wave device, the cavity-defining structure including walls and a roof. The photosensitive resin can include a phenol resin. The photosensitive resin can be relatively thin. Edge portions of a piezoelectric substrate can be free from the photosensitive resin.

公开(公告)号：US11750174B2

公开(公告)日：2023-09-05

申请号：US17364314

申请日：2021-06-30

Applicant: Skyworks Solutions, Inc.

Inventor： Yoshiaki Ando ,  Yasuyuki Saito ,  Hiroyuki Nakamura

IPC: H03H9/70 ,  H03H9/72 ,  H03H9/54 ,  H03H9/205 ,  H03H9/64 ,  H03H9/02 ,  H03H9/00 ,  H03H9/10 ,  H03H9/17 ,  H03H9/25 ,  H03H9/56 ,  H04L5/14

CPC classification number: H03H9/706 ,  H03H9/0009 ,  H03H9/0014 ,  H03H9/02007 ,  H03H9/105 ,  H03H9/1092 ,  H03H9/171 ,  H03H9/205 ,  H03H9/25 ,  H03H9/54 ,  H03H9/542 ,  H03H9/568 ,  H03H9/64 ,  H03H9/6483 ,  H03H9/703 ,  H03H9/72 ,  H03H9/725 ,  H04L5/14

Abstract: Multiplexers are disclosed. A multiplexer can include a first filter and a second filter that are coupled to a common node. The second filter can include a first type of acoustic wave resonators (e.g., bulk acoustic wave resonators) and a series acoustic wave resonator of a second type (e.g., a surface acoustic wave resonator) that is coupled between the acoustic wave resonators of the first type and the common node. The first filter can provide a single-ended radio frequency signal. In certain embodiments, the first filter can be a receive filter and the second filter can be a transmit filter.

公开(公告)号：US20230253950A1

公开(公告)日：2023-08-10

申请号：US17649965

申请日：2022-02-04

Applicant: RF360 Europe GmbH

Inventor： Simone Colasanti ,  Nadine Erhard-Egeler ,  Stefan Leopold Hatzl ,  Manuel Hofer ,  Peter Kirchhofer ,  Volker Schulz

IPC: H03H9/02 ,  H03H3/08 ,  H03H9/10 ,  H03H9/64 ,  H03H9/72

CPC classification number: H03H9/02913 ,  H03H3/08 ,  H03H9/1071 ,  H03H9/1092 ,  H03H9/6489 ,  H03H9/725

Abstract: A stacked AW filter package includes a first substrate stacked on a second substrate. The first substrate has a first AW filter circuit on first surface and a metal layer on a second surface. The second substrate has a second AW filter circuit disposed in a cavity between the metal layer of the first substrate and a third surface of the second substrate. The metal layer is coupled to the second AW filter circuit by a metal interconnect formed in a metallization layer on a side surface of the first substrate. The metal layer provides isolation to reduce cross-talk (e.g., electromagnetic interference) within the stacked AW filter package between the first AW filter circuit and the second AW filter circuit. Including the metal layer in the stacked AW filter package improves signal quality of transmitted and received signals filtered in the first and second AW filter circuits.