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1.发明授权Component assembly with solder glass preform for lighting device and sealing process 失效组件装配用焊接玻璃预制件用于照明装置和密封过程公开(公告)号：US06987359B2
公开(公告)日：2006-01-17
申请号：US10284581
申请日：2002-10-31
摘要： Disclosed are a component assembly for an electrical lighting device and method for sealing the same. The assembly comprises the component, such as an electrode lead wire, and a solder glass perform. The component assembly is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low-pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto without causing damage to other lamp components sensitive to high temperature. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300° C. in the range of 30–45×10−7° C.−1.
摘要翻译： 公开了一种用于电照明装置的部件组件及其密封方法。 组件包括诸如电极引线和焊料玻璃之类的部件。 组件组件可用于例如将诸如电引线和排气管的灯组件气密地密封和固定到具有已经施加到其上的荧光体涂层的低压荧光放电灯泡，而不会对对其敏感的其它灯组件 高温。 本发明特别适用于由硼硅酸盐玻璃制成的灯壳，其具有0至300℃的CTE，范围为30-45×10 -7℃。 >。
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2.发明授权Sealing lighting device component assembly with solder glass preform by using infrared radiation 失效通过使用红外辐射的焊接玻璃预制件密封照明装置部件组件公开(公告)号：US07040121B2
公开(公告)日：2006-05-09
申请号：US10284588
申请日：2002-10-31
摘要： Disclosed is a method for sealing and affixing a component assembly for an electrical lighting device to a glass lamp envelope. The assembly used in the process comprises the component, such as an electrode lead wire and a solder glass perform. The process is useful, for example, in hermetically sealing and affixing lamp components, such as electrical lead wires and exhaust tubulation, to a low pressure fluorescent discharge lamp envelope having phosphor coating already applied thereto. The present invention is particularly suitable for lamp envelope made of borosilicate glass having a CTE from 0 to 300° C. in the range of 30–45×10−7° C.−1.
摘要翻译： 公开了一种用于将电气照明装置的部件组件密封和固定到玻璃灯罩的方法。 在该方法中使用的组件包括诸如电极引线和焊料玻璃的部件。 该方法例如在将灯组件（例如电引线和排气管）气密地密封并固定到已经施加有荧光体涂层的低压荧光放电灯壳上是有用的。 本发明特别适用于由硼硅酸盐玻璃制成的灯壳，其具有0至300℃的CTE，范围为30-45×10 -7℃。 >。
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