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1.发明授权Vinyl-benzyl ethers of phenol-dicyclopentadiene adducts as new thermosetting resins for composites 失效苯酚 - 二环戊二烯加成物的乙烯基 - 苄基醚作为复合材料的新型热固性树脂
公开(公告)号：US4824920A
公开(公告)日：1989-04-25
申请号：US126312
申请日：1987-11-30
申请人： Joseph J. Zupancic , Jeffrey P. Conrad , James A. Wrezel , Andrew M. Zweig , Jean M. J. Frechet
发明人： Joseph J. Zupancic , Jeffrey P. Conrad , James A. Wrezel , Andrew M. Zweig , Jean M. J. Frechet
摘要： The resins resulting from converting dicyclopentadiene-phenol adducts to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from therma, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.
摘要翻译： 将二环戊二烯 - 苯酚加合物转化成其相应的乙烯基苄基醚所产生的树脂是嵌入纤维以生产复合材料的优异基体。 这种树脂，特别是作为具有不同分子量分布的材料的混合物，是玻璃化转变温度好于固化温度的无定形材料，并且其溶解度允许高固含量的溶液，以便提供具有高树脂含量的涂层。 由热，光化学或自由基引发的聚合产生的广泛交联的聚合物具有优异的用于多层电路板的热和电特性。
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公开(公告)号：US4786700A
公开(公告)日：1988-11-22
申请号：US947590
申请日：1986-12-30
IPC分类号： C08F212/34 , H05K1/03 , C08F216/12
CPC分类号： H05K1/0326 , C08F212/34
摘要： Homogeneous thermosetting copolymers comprising a mixture of styrene-terminated tetrakisphenols and compounds containing at least one pendant vinyl group as exemplified by styrene-terminated tetrakisphenol ethane and styrene-terminated bisphenol A will possess desirable characteristics such as low dielectric constants and high glass transition temperatures. These polymers may be utilized as a component in laminates or circuit boards which are employed in relatively complicated pieces of electronic equipment.
摘要翻译： 包含苯乙烯封端的四苯酚和含有至少一个乙烯基侧链的化合物的混合物的均匀的热固性共聚物如苯乙烯封端的四苯酚乙苯和苯乙烯封端的双酚A所例举将具有期望的特性，例如低介电常数和高玻璃化转变温度。 这些聚合物可以用作在相对复杂的电子设备中使用的层压板或电路板中的组件。
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3.发明授权Styrene terminated multifunctional oligomeric phenols as new thermosetting resins for composites 失效苯乙烯封端的多官能低聚酚作为复合材料的新型热固性树脂
公开(公告)号：US4855375A
公开(公告)日：1989-08-08
申请号：US276598
申请日：1988-11-28
IPC分类号： C07C43/225 , C08G8/08 , C08G8/28 , C08G8/36 , H05K1/03
CPC分类号： C08G8/36 , C07C43/225 , C08G8/08 , C08G8/28 , H05K1/0326
摘要： Thermosetting resins which are essentially vinylbenzyl end-capped ethers of the oligomeric condensation products of certain dihydric phenols and formaldehyde are readily polymerized to give an extensively cross-linked polymer particularly useful in printed circuit boards and similar laminates. Effective cost reduction may be enjoyed by replacing up to 50% of the vinylbenzyl moieties by other groups, such as alkyl and benzyl groups, without destroying the usefulness of the resulting thermosetting resins. The vinylbenzyl ether product from bisphenol-A is especially recommended.
摘要翻译： 基本上是某些二元酚和甲醛的低聚缩合产物的乙烯基苄基封端醚的热固性树脂很容易聚合，得到在印刷电路板和类似层压材料中特别有用的广泛交联的聚合物。 通过用其它基团（例如烷基和苄基）代替多达50％的乙烯基苄基部分可以有效降低成本，而不会破坏所得的热固性树脂的有用性。 特别推荐双酚-A的乙烯基苄基醚产物。
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4.发明授权Styrene terminated multifunctional oligomeric phenols as new thermosetting resins for composites 失效苯乙烯封端的多官能低聚酚作为复合材料的新型热固性树脂
公开(公告)号：US4900794A
公开(公告)日：1990-02-13
申请号：US369369
申请日：1989-06-21
IPC分类号： C07C43/225 , C08G8/08 , C08G8/28 , H05K1/03
CPC分类号： C08G8/08 , C07C43/225 , C08G8/28 , H05K1/0326 , Y10T428/31504
摘要： Thermosetting resins which are essentially vinylbenzyl end-capped ethers of the oligomeric condensation products of certain dihydric phenols and formaldehyde are readily polymerized to give an extensively cross-linked polymer particularly useful in printed circuit boards and similar laminates. Effective cost reduction may be enjoyed by replacing up to 50% of the vinylbenzyl moieties by other groups, such as alkyl and benzyl groups, without destroying the usefulness of the resulting thermosetting resins. The vinylbenzyl ether product from bisphenol-A is especially recommended.
摘要翻译： 基本上是某些二元酚和甲醛的低聚缩合产物的乙烯基苄基封端醚的热固性树脂很容易聚合，得到在印刷电路板和类似层压材料中特别有用的广泛交联的聚合物。 通过用其它基团（例如烷基和苄基）代替多达50％的乙烯基苄基部分可以有效降低成本，而不会破坏所得的热固性树脂的有用性。 特别推荐双酚-A的乙烯基苄基醚产物。
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公开(公告)号：US4728708A
公开(公告)日：1988-03-01
申请号：US947007
申请日：1986-12-29
IPC分类号： C07C43/215 , C07C43/225 , C08F12/34 , H05K1/03 , C08F279/00
CPC分类号： C07C43/215 , C07C43/225 , C08F12/34 , H05K1/0326
摘要： Thermoset polymers of styrene terminated tetrakis phenols may be prepared from resins which possess the generic formula ##STR1## in which R is selected from the group consisting of alkyl, cycloalkyl, alkaryl and substituted alkaryl radicals and X is independently selected from the group consisting of hydrogen and halogen atoms. These polymers will be utilized as a component in laminates on circuit boards which are employed in relatively complicated pieces of electronic equipment.
摘要翻译： 苯乙烯封端的四苯酚的热固性聚合物可以由具有通式
+ TR 的树脂制备，其中R选自烷基，环烷基，烷芳基和取代的烷芳基，X独立地选自 由氢和卤原子组成的组。 这些聚合物将用作电路板中用于相对复杂的电子设备中的层压板中的组分。 -
6.发明授权Ethers of oligomeric phenol-dialdehyde condensation products and a vinyl-benzyl compound 失效低聚苯酚 - 二醛缩合产物的醚和乙烯基 - 苄基化合物
公开(公告)号：US4816498A
公开(公告)日：1989-03-28
申请号：US126313
申请日：1987-11-30
CPC分类号： H01B3/44 , C08G8/28 , H05K1/0326
摘要： Oligomeric condensation products of certain dialdehydes and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of glyoxal with from 3 to 4 molar proportions of phenol and end-capped with from 50 to 85% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.
摘要翻译： 某些二醛和酚的低聚缩合产物可以用乙烯基苄基部分和某些其它部分（特别是烷基）封端，以提供在制备层压电路板时特别有价值的热固性树脂。 通过1摩尔比例的乙二醛与3至4摩尔比例的苯酚反应并用50至85％乙烯基苄基和其余为1至11个碳原子的烷基封端的树脂制备的树脂是特别有用的。
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7.发明授权Ethers of oligomeric phenol-diketone condensation products and a vinyl-benzyl compound 失效低聚苯酚 - 二酮缩合产物和乙烯基 - 苄基化合物的醚
公开(公告)号：US4921923A
公开(公告)日：1990-05-01
申请号：US272954
申请日：1988-11-18
CPC分类号： H01B3/44 , C08G8/28 , H05K1/03 , H05K1/0326
摘要： Oligomeric condensation products of certain diketones and phenols can be end-capped with a vinylbenzyl moiety and certain other moieties, especially alkyl groups, to afford thermosetting resins particularly valuable in making laminated circuit boards. Resins prepared by the reaction of 1 molar proportion of diacetylbenzene with from 3.5 to 4.0 molar proportions of phenol and end-capped with from 50 to 100% vinylbenzyl groups with the remainder being alkyls of 1 through 11 carbon atoms are particularly useful.
摘要翻译： 某些二酮和酚的低聚缩合产物可以用乙烯基苄基部分和某些其它部分（特别是烷基）封端以提供在制备层压电路板中特别有价值的热固性树脂。 通过1摩尔比例的二乙酰苯与3.5至4.0摩尔比例的苯酚反应并用50至100％乙烯基苄基封端的残基制备的树脂，其余为1至11个碳原子的烷基是特别有用的。
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公开(公告)号：US4871831A
公开(公告)日：1989-10-03
申请号：US126314
申请日：1987-11-30
申请人： Andrew M. Zweig , Jeffrey P. Conrad
发明人： Andrew M. Zweig , Jeffrey P. Conrad
IPC分类号： C07C41/16 , C07C41/38 , C07C43/20 , C07C43/215 , C07C43/225 , H05K1/03
CPC分类号： C07C41/16 , C07C41/38 , H05K1/0326 , Y10S525/934
摘要： A method is presented to prepare totally functionalized ether-capped oligomeric polyphenols without molecular weight fractionation. The products generally are very low in inorganic salts and are characterized by the absence of volatiles leading to void formation in their subsequent curing. The success of the method rests upon conducting the reaction under totally homogeneous conditions throughout.
摘要翻译： 提出了一种无需分子量分级制备完全功能化的乙烯基封端的低聚多酚的方法。 产物通常在无机盐中非常低，并且其特征在于没有挥发物在其后续固化中导致空隙形成。 该方法的成功取决于在完全均匀的条件下进行反应。
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9.发明授权Poly(vinyl chloride) compositions exhibiting increased adhesivity to polyamide and multi-layer structures comprising the same 失效聚氯乙烯组合物表现出对聚酰胺的粘附性增加和包含其的多层结构
公开(公告)号：US5324588A
公开(公告)日：1994-06-28
申请号：US580232
申请日：1990-09-10
CPC分类号： H01B3/305 , B32B27/08 , H01B3/443 , Y10T428/31681 , Y10T428/31725 , Y10T428/31739 , Y10T428/31743 , Y10T428/31757 , Y10T428/3192
摘要： Improved poly(vinyl chloride) compositions which exhibit improved adhesivity to polyamide which find particular utility in the construction of multi-layer structures, particularly for the fabrication of improved structures for use in forming electrical insulation structures for wires and cables. In one useful embodiment, the multi-layer structure has in the following order: a layer of PVC and a layer of polyamide in contact with the layer of PVC wherein the layer of PVC includes a vinyl chloride containing copolymer or a terpolymer which exhibits good solubility with the PVC, and which further provides good adhesivity with the PA. The vinyl resin is selected from the group consisting of vinyl chloride-vinyl acetate-vinyl alcohol terpolymers.
摘要翻译： 改进的聚（氯乙烯）组合物显示出改进的聚酰胺粘附性，其在多层结构的构造中特别有用，特别是用于制造用于形成用于电线和电缆的电绝缘结构的改进结构。 在一个有用的实施方案中，多层结构具有以下顺序：PVC层和与PVC层接触的聚酰胺层，其中PVC层包含含氯乙烯的共聚物或显示出良好溶解度的三元共聚物 与PVC，并进一步提供良好的粘合性与PA。 乙烯基树脂选自氯乙烯 - 乙酸乙烯酯 - 乙烯醇三元共聚物。
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公开(公告)号：US4914171A
公开(公告)日：1990-04-03
申请号：US263152
申请日：1988-10-26
申请人： Andrew M. Zweig
发明人： Andrew M. Zweig
摘要： A difunctional epoxy acrylate monomer is prepared by reacting a highly fluorinated diglycidyl either with an excess of acrylic acid in the presence of a suitable catalyst. The acrylate has the following structure; ##STR1## where N is an integer from 1 to 30. This monomer is totally miscible with nonfluorinated polyacrylates. Clear, colorless, low refractive index polymers can be prepared by polymerization of this monomer or blends with other acrylates to give products useful as low surface energy coatings, and low refractive index coatings, on a wide range of substrates.
摘要翻译： 通过在合适的催化剂存在下使高度氟化的二缩水甘油基与过量的丙烯酸反应来制备双官能环氧丙烯酸酯单体。 丙烯酸酯具有以下结构：
+ TR 其中N是1至30的整数。该单体与非氟化聚丙烯酸酯完全混溶。 透明，无色，低折射率的聚合物可以通过将该单体或与其它丙烯酸酯的共混物聚合来制备，以在宽范围的基材上提供用作低表面能涂层和低折射率涂层的产品。
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