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    ARCHITECTURE FOR ORGANIC ELECTRONIC DEVICES
    1.
    发明申请
    ARCHITECTURE FOR ORGANIC ELECTRONIC DEVICES 审中-公开
    有机电子设备架构

    公开(公告)号：US20110163337A1

    公开(公告)日：2011-07-07

    申请号：US12683355

    申请日：2010-01-06

    申请人： Joseph John Shiang ,  Anil Raj Duggal ,  Jeffrey Michael Youmans

    发明人： Joseph John Shiang ,  Anil Raj Duggal ,  Jeffrey Michael Youmans

    IPC分类号： H01L33/00 ,  H01L21/30

    CPC分类号： H05B33/0896 ,  H01L27/3202 ,  H01L27/3204 ,  H01L27/3293 ,  H01L51/5206 ,  H01L2251/5361

    摘要： Provided are organic device packages configured to limit current flow through shorted sub-elements in the organic device. In some embodiments, the organic device package may include multiple elements, each having multiple sub-elements connected in parallel. Each element may have a first electrode patterned into thin electrode strips connected in parallel, and each of the electrode strips may be an electrode of one of the multiple sub-elements. The electrode strips may have a resistance which may be higher than the overall resistance of other sub-elements in the element, such that a current flowing to the element may be substantially limited from flowing through a shorted sub-element in the element. Each element may also be connected in series to another element in the organic device package, and one or more series-connected elements may also be connected in parallel within the package.

    摘要翻译： 提供了被配置为限制通过有机器件中的短路子元件的电流流动的有机器件封装。 在一些实施例中，有机器件封装可以包括多个元件，每个元件具有并联连接的多个子元件。 每个元件可以具有图案化成平行连接的薄电极条的第一电极，并且每个电极条可以是多个子元件中的一个的电极。 电极条可以具有可以高于元件中其它子元件的总体电阻的电阻，使得流到元件的电流可以基本上限制流过元件中的短路子元件。 每个元件还可以与有机器件封装中的另一个元件串联连接，并且一个或多个串联元件也可以在封装内并联连接。

    PACKAGED OPTOELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING
    4.
    发明申请
    PACKAGED OPTOELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING 审中-公开
    包装光电装置及其制造方法

    公开(公告)号：US20130248914A1

    公开(公告)日：2013-09-26

    申请号：US13424536

    申请日：2012-03-20

    申请人： Jeffrey Michael Youmans ,  Joseph John Shiang

    发明人： Jeffrey Michael Youmans ,  Joseph John Shiang

    IPC分类号： H01L33/62 ,  H01L31/18 ,  H01L31/0203 ,  H01L33/48

    CPC分类号： H01L51/448 ,  H01L51/441 ,  H01L51/5203 ,  H01L51/524 ,  Y02E10/549 ,  Y02P70/521

    摘要： A packaged optoelectronic device and a method for manufacturing is provided. The packaged optoelectronic device includes at least one optoelectronic device with two electrodes sandwiched between a first barrier layer and a second barrier layer. At least one of the barrier layers comprises at least one aperture. Further, the packaged device includes a plurality of thin electrically conductive connectors. Each of the thin connectors extends out through the at least one aperture and is coupled to the anode or the cathode. Further, the thin connectors are connected to an external power source to provide power to the anode and the cathode.

    摘要翻译： 提供一种封装的光电子器件及其制造方法。 封装的光电器件包括至少一个光电子器件，其中两个电极夹在第一阻挡层和第二阻挡层之间。 阻挡层中的至少一个包括至少一个孔。 此外，封装装置包括多个薄导电连接器。 每个细连接器通过至少一个孔延伸出来并且耦合到阳极或阴极。 此外，薄连接器连接到外部电源以向阳极和阴极提供电力。