STEERABLE HIGH-INTENSITY FOCUSED ULTRASOUND (HIFU) ELEMENTS

    公开(公告)号:US20190001159A1

    公开(公告)日:2019-01-03

    申请号:US16022799

    申请日:2018-06-29

    IPC分类号: A61N7/00 A61N7/02

    摘要: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities. Multiple ultrasound devices may be disposed on a substrate, which may be configured to be flexed so that the direction of emission of the ultrasound devices can be mechanically controlled. Additionally, or alternatively, the ultrasound beams produced by different ultrasound devices may be electronically oriented by adjusting the phases of the signals with which each element of a device is driven. For example, multiple phased arrays of ultrasound devices may be used to concentrate ultrasound energy into a desired location. In some embodiments, the time at which different ultrasound signals are emitted may be controlled, for example to ensure that the combined signal has at least a desired intensity.

    METHODS AND APPARATUSES FOR AZIMUTHAL SUMMING OF ULTRASOUND DATA

    公开(公告)号:US20220104793A1

    公开(公告)日:2022-04-07

    申请号:US17493775

    申请日:2021-10-04

    IPC分类号: A61B8/00 G01S15/89

    摘要: Aspects of the technology described herein related to controlling, using control circuitry, modulation circuitry to modulate and delay first ultrasound data generated by first ultrasound transducers positioned at a first azimuthal position of an ultrasound transducer array of an ultrasound device and second ultrasound data generated by second ultrasound transducers positioned at a second azimuthal position of the ultrasound transducer array of the ultrasound device, such that the first ultrasound data is delayed by a first delay amount and the second ultrasound data is delayed by a second delay amount that is different from the first delay amount. The first and second ultrasound data received from the modulation circuitry may be filtered and summed. The ultrasound transducer array, the control circuitry, the modulation circuitry, the filtering circuitry, and the summing circuitry may be integrated onto a semiconductor chip or one or more semiconductor chips packaged together.