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公开(公告)号:US20190142387A1
公开(公告)日:2019-05-16
申请号:US16192603
申请日:2018-11-15
申请人: Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
发明人: Kailiang Chen , Nevada J. Sanchez , Susan A. Alie , Tyler S. Ralston , Jonathan M. Rothberg , Keith G. Fife , Joseph Lutsky
摘要: Aspects of the technology described herein relate to an ultrasound device including a first die that includes an ultrasonic transducer, a first application-specific integrated circuit (ASIC) that is bonded to the first die and includes a pulser, and a second ASIC in communication with the second ASIC that includes integrated digital receive circuitry. In some embodiments, the first ASIC may be bonded to the second ASIC and the second ASIC may include analog processing circuitry and an analog-to-digital converter. In such embodiments, the second ASIC may include a through-silicon via (TSV) facilitating communication between the first ASIC and the second ASIC. In some embodiments, SERDES circuitry facilitates communication between the first ASIC and the second ASIC and the first ASIC includes analog processing circuitry and an analog-to-digital converter. In some embodiments, the technology node of the first ASIC is different from the technology node of the second ASIC.
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公开(公告)号:US20180376253A1
公开(公告)日:2018-12-27
申请号:US16016359
申请日:2018-06-22
IPC分类号: H04R17/00
摘要: Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic transducer element may be coupled to an integrated circuit that is configured to operate the differential ultrasonic transducer element in one or more modes of operation, such as a differential receive mode, a differential transmit mode, a single-ended receive mode, and a single-ended transmit mode.
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公开(公告)号:US20170360399A1
公开(公告)日:2017-12-21
申请号:US15626711
申请日:2017-06-19
申请人: Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
发明人: Jonathan M. Rothberg , Susan A. Alie , Nevada J. Sanchez , Tyler S. Ralston , Christopher Thomas McNulty , Jaime Scott Zahorian , Paul Francis Cristman , Matthew de Jonge , Keith G. Fife
IPC分类号: A61B8/00
CPC分类号: A61B8/4477 , A61B8/0883 , A61B8/0891 , A61B8/12 , A61B8/4236 , A61B8/4427 , A61B8/4444 , A61B8/4472 , A61B8/4494 , A61B8/465 , A61B8/467 , A61B8/483 , A61B8/485 , A61B8/488 , A61B8/5207 , A61B8/54 , A61B8/56 , B06B1/0292 , B06B1/0622
摘要: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
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公开(公告)号:US20190001159A1
公开(公告)日:2019-01-03
申请号:US16022799
申请日:2018-06-29
摘要: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities. Multiple ultrasound devices may be disposed on a substrate, which may be configured to be flexed so that the direction of emission of the ultrasound devices can be mechanically controlled. Additionally, or alternatively, the ultrasound beams produced by different ultrasound devices may be electronically oriented by adjusting the phases of the signals with which each element of a device is driven. For example, multiple phased arrays of ultrasound devices may be used to concentrate ultrasound energy into a desired location. In some embodiments, the time at which different ultrasound signals are emitted may be controlled, for example to ensure that the combined signal has at least a desired intensity.
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公开(公告)号:US20220104793A1
公开(公告)日:2022-04-07
申请号:US17493775
申请日:2021-10-04
申请人: Nevada J. Sanchez , Liewei Bao , Tyler S. Ralston
发明人: Nevada J. Sanchez , Liewei Bao , Tyler S. Ralston
摘要: Aspects of the technology described herein related to controlling, using control circuitry, modulation circuitry to modulate and delay first ultrasound data generated by first ultrasound transducers positioned at a first azimuthal position of an ultrasound transducer array of an ultrasound device and second ultrasound data generated by second ultrasound transducers positioned at a second azimuthal position of the ultrasound transducer array of the ultrasound device, such that the first ultrasound data is delayed by a first delay amount and the second ultrasound data is delayed by a second delay amount that is different from the first delay amount. The first and second ultrasound data received from the modulation circuitry may be filtered and summed. The ultrasound transducer array, the control circuitry, the modulation circuitry, the filtering circuitry, and the summing circuitry may be integrated onto a semiconductor chip or one or more semiconductor chips packaged together.
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公开(公告)号:US20180366102A1
公开(公告)日:2018-12-20
申请号:US16009319
申请日:2018-06-15
摘要: A digital microbeamformer apparatus for an ultrasound system includes a plurality of interconnected nodes, with one or more nodes corresponding to at least one channel of the ultrasound system. One or more nodes is configured to communicate data with one or more other nodes via a corresponding beamforming data path, and one or more nodes is coupled to a data output bus shared by one or more other nodes.
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公开(公告)号:US20200184176A1
公开(公告)日:2020-06-11
申请号:US16705444
申请日:2019-12-06
申请人: Jianwei Liu , Keith G. Fife , Tyler S. Ralston
发明人: Jianwei Liu , Keith G. Fife , Tyler S. Ralston
摘要: An ultrasound fingerprint sensor is described. The ultrasound fingerprint sensor may incorporate capacitive ultrasound sensing technology, for example in the form of an array of capacitive ultrasonic transducers. The ultrasound fingerprint sensor may be incorporated into various electronic equipment, such as mobile electronic equipment in the form of smartphones and tablet computers, as well as in biometric sensing equipment, such as fingerprint access terminals.
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公开(公告)号:US20190149109A1
公开(公告)日:2019-05-16
申请号:US16244934
申请日:2019-01-10
申请人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
CPC分类号: H03F3/45179 , G01N29/2406 , G01N29/44 , G01N29/4463 , G01N29/449 , H03F3/345 , H03F2200/129 , H03F2203/45116 , H03F2203/45524 , H03M1/124 , H03M1/38
摘要: An ultrasound circuit comprising a single-ended trans-impedance amplifier (TIA) is described, The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TEA is followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.
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公开(公告)号:US20180360426A1
公开(公告)日:2018-12-20
申请号:US16011715
申请日:2018-06-19
申请人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
摘要: An ultrasound circuit comprising a multi-stage trans-impedance amplifier (TIA) is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA may include multiple stages, at least two of which operate with different supply voltages. The TIA may be followed by further processing circuitry configured to filter, amplify, and digitize the signal produced by the TIA.
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公开(公告)号:US20180367111A1
公开(公告)日:2018-12-20
申请号:US16011755
申请日:2018-06-19
申请人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
发明人: Amandeep Singh , Kailiang Chen , Tyler S. Ralston
摘要: An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.
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