公开(公告)号：US20100246935A1

公开(公告)日：2010-09-30

申请号：US12415036

申请日：2009-03-31

申请人： Donald A. Hallock ,  Vincent P. Mulligan ,  Joseph P. Palmeri ,  James I. Paradies ,  Nandu N. Ranadive

发明人： Donald A. Hallock ,  Vincent P. Mulligan ,  Joseph P. Palmeri ,  James I. Paradies ,  Nandu N. Ranadive

IPC分类号： G06K9/00 ,  G06F3/048

CPC分类号： G01N23/04 ,  G01N2223/1016 ,  G01N2223/401 ,  G06T7/001 ,  G06T2207/30152

摘要： A system to facilitate analysis of component leads is provided and includes a device to form a picture of the leads, from which an image is extracted, to apportion the image and to perform first and second scans of the portions, and a processor, including a memory unit having a set of computer-readable executable instructions stored thereon, which, when executed, cause the processor to receive data of each scan, to establish a rule, based on the data of the first scan of any one portion, governing when to judge that the data of the second scan of the one portion indicates a defect, to determine rule compliance for each of the second scans, to judge that any one second scan in a non-compliance state indicates a defect, and to report a location of the defect. A display unit displays the report to a user.

摘要翻译： 提供了一种便于元件引线分析的系统，并且包括用于形成从其中提取图像的引线的图片以分配图像并执行该部分的第一和第二扫描的装置，以及包括 存储单元，其具有存储在其上的一组计算机可读可执行指令，所述一组计算机可读可执行指令在被执行时使得处理器接收每次扫描的数据，以基于任何一个部分的第一次扫描的数据建立规则， 判断一部分的第二扫描的数据表示缺陷，以确定每个第二扫描的规则符合性，以判断在不合规状态中的任何一秒扫描指示缺陷，并报告 缺陷。 显示单元向用户显示报告。

公开(公告)号：US07399930B1

公开(公告)日：2008-07-15

申请号：US11623484

申请日：2007-01-16

申请人： Joseph P. Palmeri ,  Vincent P. Mulligan

发明人： Joseph P. Palmeri ,  Vincent P. Mulligan

IPC分类号： H01R12/04

CPC分类号： H05K3/225 ,  H05K1/113 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2203/0191 ,  H05K2203/0242 ,  Y10T29/49174 ,  Y10T29/49179

摘要： Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stern and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.

摘要翻译： 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和连接船头和头部的肩部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。

公开(公告)号：US07790985B2

公开(公告)日：2010-09-07

申请号：US12136308

申请日：2008-06-10

申请人： Joseph P. Palmeri ,  Vincent P. Mulligan

发明人： Joseph P. Palmeri ,  Vincent P. Mulligan

IPC分类号： H05K1/00

CPC分类号： H05K3/225 ,  H05K1/113 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2203/0191 ,  H05K2203/0242 ,  Y10T29/49174 ,  Y10T29/49179

摘要： Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stem and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.

摘要翻译： 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和肩部，其连接杆和头部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。

公开(公告)号：US20080169119A1

公开(公告)日：2008-07-17

申请号：US11623484

申请日：2007-01-16

申请人： Joseph P. Palmeri ,  Vincent P. Mulligan

发明人： Joseph P. Palmeri ,  Vincent P. Mulligan

IPC分类号： H05K1/02 ,  H01R43/00 ,  H01R43/02 ,  H01R13/02

CPC分类号： H05K3/225 ,  H05K1/113 ,  H05K3/0047 ,  H05K3/3447 ,  H05K3/4046 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2203/0191 ,  H05K2203/0242 ,  Y10T29/49174 ,  Y10T29/49179

摘要： Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed circuit board in a location that is substantially centered on an axis passing through the via, and a replacement structure is inserted into the countersink hole. The replacement structure has a stem portion, a head portion, and a shoulder portion that connects the stern and head portions, with the angle of the shoulder portion substantially matching the angle of the shoulder of the countersink hole. The stem portion of the replacement structure is permanently attached to sidewalls of the via so as to electrically couple the head portion of the replacement structure to the via.

摘要翻译： 提供了用于修复位于印刷电路板的第一表面上并连接到通过电路板的通孔的损坏的接触垫的方法和装置。 根据该方法，在印刷电路板的第一表面中形成基本上位于通过通孔的轴的中心的位置上形成埋头孔，并且将更换结构插入到埋头孔中。 替换结构具有杆部，头部和连接船头和头部的肩部，肩部的角度基本上与埋头孔的肩部的角度相匹配。 替换结构的杆部分永久地附接到通孔的侧壁，以便将替换结构的头部部分电连接到通孔。