Abstract:
A macroscopic mirror for wide angle scanning applications comprises: a silicon substrate section of a predetermined shape and macroscopic size cut from a silicon wafer comprising a flat, polished surface side and an etched, rough surface side; and a plurality of layers, including a layer of reflective medium, disposed on the flat, polished surface of the substrate section in such a manner to minimize flexural distortion of the flat surface. The macroscopic mirror is made by a method comprising the steps of: preparing the silicon wafer by polishing one side to a predetermined flatness and etching the other side to a predetermined roughness; cutting the substrate section from the prepared silicon wafer to a predetermined shape and macroscopic size; and applying the plurality of layers on the flat, polished surface. The macroscopic mirror is included in a mirror system wherein the rough surface side is bonded to supporting arms of a drive mechanism which scans the mirror at a predetermined scanning rate in at least one plane of rotation.
Abstract:
A macroscopic mirror for wide angle scanning applications comprises: a silicon substrate section of a predetermined shape and macroscopic size cut from a silicon wafer comprising a flat, polished surface side and an etched, rough surface side; and a plurality of layers, including a layer of reflective medium, disposed on the flat, polished surface of the substrate section in such a manner to minimize flexural distortion of the flat surface. The macroscopic mirror is made by a method comprising the steps of: preparing the silicon wafer by polishing one side to a predetermined flatness and etching the other side to a predetermined roughness; cutting the substrate section from the prepared silicon wafer to a predetermined shape and macroscopic size; and applying the plurality of layers on the flat, polished surface. The macroscopic mirror is included in a mirror system wherein the rough surface side is bonded to supporting arms of a drive mechanism which scans the mirror at a predetermined scanning rate in at least one plane of rotation.
Abstract:
A forward looking cross-track laser altimeter comprises: a first configuration of optical elements for guiding pulsed laser beams along a first optical path; a mirror element coupled to a scanner and disposed in the first optical path, the scanner operative to oscillate the mirror element to sweep the reflected laser beams back and forth across a line at a predetermined frequency; the scanner and mirror element configurable to reflect the pulsed laser beams along paths forward and downward at a predetermined angle to the flight path of the aircraft, wherein the pulsed laser beam paths are caused to be line swept across a ground track forward the aircraft; the mirror element for receiving returns of the pulsed laser beams from the terrain and objects on the terrain forward the aircraft and reflecting the returns along a second optical path to a light detector which produces a return signal in response thereto; a first circuit governed by the return signals for measuring times-of-flight of the returns and generating time-of-flight signals corresponding thereto; the scanner for generating a line sweep position signal; and a second circuit for generating for each return a data profile comprising range and line sweep position thereof based on the corresponding time-of-flight and position signals.