公开(公告)号：US20110089576A1

公开(公告)日：2011-04-21

申请号：US12997206

申请日：2009-05-22

申请人： Joung Cheul CHOI ,  An Young Kim ,  Joon Ho Na ,  Dae Seong Kim ,  Dae Keun Han

发明人： Joung Cheul CHOI ,  An Young Kim ,  Joon Ho Na ,  Dae Seong Kim ,  Dae Keun Han

IPC分类号： H01L23/52

CPC分类号： G02F1/1345 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

摘要： A pad layout structure of a driver IC chip to be mounted to a liquid crystal display panel. The pad layout structure includes power pad sections placed at respective four corners of the driver IC chip and each having a first power pad for supplying first power to the driver IC chip, a second power pad for supplying second power to the driver IC chip, a third power pad for supplying third power to the driver IC chip and a fourth power pad for supplying fourth power to the driver IC chip.

摘要翻译： 要安装到液晶显示面板的驱动器IC芯片的焊盘布局结构。 焊盘布局结构包括放置在驱动器IC芯片的四个角的功率焊盘部分，并且每个具有用于向驱动器IC芯片提供第一电力的第一电源焊盘，用于向驱动器IC芯片提供第二电力的第二电源焊盘， 用于向驱动器IC芯片提供第三电力的第三电源焊盘和用于向驱动器IC芯片提供第四电力的第四电源焊盘。

公开(公告)号：US20110075390A1

公开(公告)日：2011-03-31

申请号：US12883555

申请日：2010-09-16

申请人： Joung Cheul CHOI ,  Joon Ho NA ,  Dae Seong KIM

发明人： Joung Cheul CHOI ,  Joon Ho NA ,  Dae Seong KIM

IPC分类号： H05K7/00

CPC分类号： H01L24/06 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2224/45099

摘要： A pad layout structure of a driver IC chip of a liquid crystal display device includes dummy power pads and dummy ground pads, which are disposed in corners of the driver IC chip and are connected to main power pads and main ground pads by metal lines in a chip-on-film (COF) package. Accordingly, it is possible to reduce the resistance of power supply lines and ground lines, to minimize a power dip of a block located far away from the main power pads and main ground pads, and to prevent a failure in power application, which may occur due to a decrease of adhesive strength at a specific position, by dispersing the adhesion positions of the power pads and ground pads.

摘要翻译： 液晶显示装置的驱动器IC芯片的焊盘布局结构包括设置在驱动器IC芯片的拐角中的虚拟电源焊盘和伪接地焊盘，并且通过金属线连接到主电源焊盘和主接地焊盘 片上电影（COF）封装。 因此，可以降低供电线路和接地线的电阻，以使距离主电源焊盘和主接地焊盘更远的块的功率下降最小化，并且防止可能发生的电力施加故障 由于通过分散电源焊盘和接地焊盘的粘合位置而在特定位置处的粘合强度降低。