公开(公告)号：US10345874B1

公开(公告)日：2019-07-09

申请号：US15144612

申请日：2016-05-02

Applicant: Juniper Networks, Inc.

Inventor： Susheela Nanjunda Rao Narasimhan ,  Basavaraja Munishamappa ,  Troy M. Sheets ,  Luis Zamora ,  Seongchul C. Kim

IPC: H05K1/02 ,  H05K7/20 ,  H01L23/40 ,  H01L23/367 ,  G06F1/20

Abstract: The disclosed apparatus may include (1) a ganged heatsink base that (A) absorbs heat dissipated by a plurality of electronic components that consume differing amounts of power and (B) includes a plurality of thermal regions dedicated to absorbing the heat dissipated by the plurality of electronic components and (2) at least one thermal isolation engine that (A) is incorporated into the ganged heatsink base, (B) separates the plurality of thermal regions from one another, and (C) localizes the heat dissipated by the plurality of electronic components by maintaining at least some of the heat dissipated by one of the electronic components within the thermal region that absorbed the at least some of the heat such that the at least some of the heat does not migrate to another thermal region included in the ganged heatsink base. Various other apparatuses, systems, and methods are also disclosed.