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公开(公告)号：US10121727B1
公开(公告)日：2018-11-06
申请号：US15681333
申请日：2017-08-18
Applicant: Juniper Networks, Inc.
Inventor： Michael E. Lucas , Nikola Ikonomov , John I. Kull
Abstract: The disclosed apparatus may include (1) a cage designed to hold an optical module, (2) a ramp that is secured to the cage and supports a heat sink such that the heat sink is capable of moving along the ramp, and (3) at least one spring having one end coupled to the ramp and another end coupled to the heat sink, wherein (A) prior to insertion of the optical module into the cage, the spring exerts a force at least partially directed along an axis of insertion of the optical module and (B) insertion of the optical module into the cage moves the heat sink along the ramp such that the force exerted by the spring (I) rotates away from the axis of insertion and (II) presses the heat sink against a surface of the optical module. Various other apparatuses, systems, and methods are disclosed.
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公开(公告)号：US10788637B2
公开(公告)日：2020-09-29
申请号：US16231038
申请日：2018-12-21
Applicant: Juniper Networks, Inc.
Inventor： Nikola Ikonomov , Christopher Otte , Attila I. Aranyosi
Abstract: The disclosed apparatus may include (1) a plurality of individual heatsink bases designed to interface with a plurality of removable communication modules installed on a telecommunications device, (2) a plurality of heat pipes that are thermally coupled to the individual heatsink bases, and (3) a ganged heat exchanger that is (A) mechanically coupled to the telecommunications device and (B) thermally coupled to the heat pipes. Various other apparatuses, systems, and methods are also disclosed.
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公开(公告)号：US11991863B2
公开(公告)日：2024-05-21
申请号：US17532633
申请日：2021-11-22
Applicant: Juniper Networks, Inc.
Inventor： Nikola Ikonomov , Attila I. Aranyosi , Sean Kim
CPC classification number: H05K7/2049 , G06F1/20
Abstract: A disclosed apparatus may include (1) a heat-emitting component, (2) a heatsink that includes a designated area thermally coupled to the heat-emitting component, (3) a plurality of springs that apply forces that support the thermal coupling between the designated area of the heatsink and the heat-emitting component, and (4) a pressure plate that concentrates the forces applied by the springs toward the designated area of the heatsink. Various other apparatuses, systems, and methods are also disclosed.
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公开(公告)号：US20230164956A1
公开(公告)日：2023-05-25
申请号：US17532633
申请日：2021-11-22
Applicant: Juniper Networks, Inc.
Inventor： Nikola Ikonomov , Attila I. Aranyosi , Sean Kim
CPC classification number: H05K7/2049 , G06F1/20
Abstract: A disclosed apparatus may include (1) a heat-emitting component, (2) a heatsink that includes a designated area thermally coupled to the heat-emitting component, (3) a plurality of springs that apply forces that support the thermal coupling between the designated area of the heatsink and the heat-emitting component, and (4) a pressure plate that concentrates the forces applied by the springs toward the designated area of the heatsink. Various other apparatuses, systems, and methods are also disclosed.
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