摘要:
A bi-directional universal serial bus (“USB”) circuit for boosting a signal on a USB bus disclosed. The circuit includes a first stage inverting buffer coupled to a second stage inverting buffer to form a non-inverting buffer circuit. A high pass filter is coupled in series with the non-inverting buffer circuit to provide AC coupling to the USB bus and to allow fast signal edges through the circuit. The booster circuit is arranged to improve signal quality over a USB bus to allow additional USB devices and longer USB busses to be utilized.
摘要:
A method of transmitting a signal on a bi-directional universal serial bus (“USB”) circuit for boosting a signal on a USB bus disclosed. The circuit includes a first stage inverting buffer coupled to a second stage inverting buffer to form a non-inverting buffer circuit. A high pass filter is coupled in series with the non-inverting buffer circuit to provide AC coupling to the USB bus and to allow fast signal edges through the circuit. The booster circuit is arranged to improve signal quality over a USB bus to allow additional USB devices and longer USB busses to be utilized.
摘要:
A design structure embodied in a machine readable storage medium for designing, manufacturing, and/or testing a memory module system and DIMM connector is provided. A DIMM connector includes a plurality of DIMM sockets for receiving a corresponding plurality of DIMMs in a radially oriented, angularly spaced orientation. The DIMM sockets are connected in parallel at a memory module junction so that socket terminals of each DIMM socket are joined to the same relative terminal of all the other DIMM sockets along electronic pathways of substantially equal length. A memory controller selectively communicates with the DIMMs via the DIMM junction. By virtue of the improved topology, impedance within the DIMM connector may be better matched to minimize reflections and improve signal quality.
摘要:
A printed circuit board (‘PCB’) with reduced dielectric loss, including conductive traces disposed upon layers of dielectric material, the layers of dielectric material including core layers and prepreg layers, one or more of the layers of dielectric material including pockets of air that reduce an overall relative dielectric constant of the PCB.