Sputtering target, method for producing same, sputtering thin film formed by using such sputtering target, and organic EL device using such thin film
    1.
    发明授权
    Sputtering target, method for producing same, sputtering thin film formed by using such sputtering target, and organic EL device using such thin film 失效
    溅射靶,其制造方法,通过使用这种溅射靶形成的溅射薄膜,以及使用这种薄膜的有机EL器件

    公开(公告)号:US08029655B2

    公开(公告)日:2011-10-04

    申请号:US11996550

    申请日:2006-07-03

    IPC分类号: C23C14/00

    摘要: Provided is a sputtering target which can give a high water barrier property and a high flexibility to a sputtering film, can keep a high film forming rate certainly in sputtering, and can make damages to an objective substance wherein a film is to be formed as small as possible. In order to realize this, a mixed powder which contains 20 to 80% by weight of a SiO powder, the balance of the powder being made of a TiO2 powder and/or a Ti powder, is pressed and sintered. The sintered body has a composition of SiαTiβOγ wherein α, β and γ are mole ratios of Si, Ti and O, respectively, and the ratio of α/β ranges from 0.45 to 7.25 and the ratio of γ/(α+β) ranges from 0.80 to 1.70.

    摘要翻译: 本发明提供能够赋予溅射膜高的阻水性和高柔性的溅射靶,能够在溅射中保持高的成膜速度,并且可能会对要形成的膜的目标物质造成损害 尽可能。 为了实现这一点,将含有20〜80重量%的SiO粉末,剩余的粉末由TiO 2粉末和/或Ti粉末制成的混合粉末进行压制和烧结。 该烧结体具有SiαTi&bgr;Oγ的组成,其中α,bgr; 和γ分别为Si,Ti和O的摩尔比,α/ 范围为0.45〜7.25,γ/(α+和bgr)的比例范围为0.80〜1.70。

    SPUTTERING TARGET, METHOD FOR PRODUCING SAME, SPUTTERING THIN FILM FORMED BY USING SUCH SPUTTERING TARGET, AND ORGANIC EL DEVICE USING SUCH THIN FILM
    2.
    发明申请
    SPUTTERING TARGET, METHOD FOR PRODUCING SAME, SPUTTERING THIN FILM FORMED BY USING SUCH SPUTTERING TARGET, AND ORGANIC EL DEVICE USING SUCH THIN FILM 失效
    溅射靶,其制造方法,使用这种溅射靶材形成的溅射薄膜以及使用这种薄膜的有机EL器件

    公开(公告)号:US20090127108A1

    公开(公告)日:2009-05-21

    申请号:US11996550

    申请日:2006-07-03

    IPC分类号: C23C14/34 B22F3/10 B27N3/02

    摘要: Provided is a sputtering target which can give a high water barrier property and a high flexibility to a sputtering film, can keep a high film forming rate certainly in sputtering, and can make damages to an objective substance wherein a film is to be formed as small as possible. In order to realize this, a mixed powder which contains 20 to 80% by weight of a SiO powder, the balance of the powder being made of a TiO2 powder and/or a Ti powder, is pressed and sintered. The sintered body has a composition of SiαTiβOγ wherein α, β and γ are mole ratios of Si, Ti and O, respectively, and the ratio of α/β ranges from 0.45 to 7.25 and the ratio of γ/(α+β) ranges from 0.80 to 1.70.

    摘要翻译: 本发明提供能够赋予溅射膜高的阻水性和高柔性的溅射靶,能够在溅射中保持高的成膜速度,并且可能会对要形成的膜的目标物质造成损害 尽可能。 为了实现这一点,将含有20〜80重量%的SiO粉末,剩余的粉末由TiO 2粉末和/或Ti粉末制成的混合粉末进行压制并烧结。 烧结体具有SialphaTibetaOgamma的组成,其中α,β和γ分别是Si,Ti和O的摩尔比,α/β范围在0.45至7.25之间,γ/(α+β)的比例 从0.80到1.70。