公开(公告)号：US20170320188A1

公开(公告)日：2017-11-09

申请号：US15373703

申请日：2016-12-09

Applicant: K.C.Tech Co., Ltd.

Inventor： Young Kyu Kweon ,  Byoung Chaul Son ,  Moon Gi Cho ,  Joon Ho An

IPC: B24B37/20 ,  H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B3/12 ,  B08B3/08 ,  H01L21/306

Abstract: A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.

公开(公告)号：US10518382B2

公开(公告)日：2019-12-31

申请号：US15373703

申请日：2016-12-09

Applicant: K.C.Tech Co., Ltd.

Inventor： Young Kyu Kweon ,  Byoung Chaul Son ,  Moon Gi Cho ,  Joon Ho An

IPC: B24B37/20 ,  B08B3/02 ,  B08B3/08 ,  B08B3/12 ,  H01L21/02 ,  H01L21/306 ,  H01L21/67

Abstract: A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.