公开(公告)号：US10002777B2

公开(公告)日：2018-06-19

申请号：US15363334

申请日：2016-11-29

Applicant: K.C.Tech Co., Ltd.

Inventor： Young Kyu Kweon ,  Joon Ho An ,  Byoung Chaul Son ,  Jin Sung Rho

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67023 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/67288 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68707

Abstract: Provided is a substrate processing system and a substrate processing method. The substrate processing system includes a polishing part for performing a Chemical Mechanical Polishing (CMP) process on a substrate, a cleaning part for cleaning the substrate on which the polishing process is performed, and a substrate transferring part for transferring the substrate to the cleaning part before polishing the substrate in the polishing part. The substrate may be preparatorily cleaned in the cleaning part before the polishing process, and then enters the polishing part.

公开(公告)号：US10518382B2

公开(公告)日：2019-12-31

申请号：US15373703

申请日：2016-12-09

Applicant: K.C.Tech Co., Ltd.

Inventor： Young Kyu Kweon ,  Byoung Chaul Son ,  Moon Gi Cho ,  Joon Ho An

IPC: B24B37/20 ,  B08B3/02 ,  B08B3/08 ,  B08B3/12 ,  H01L21/02 ,  H01L21/306 ,  H01L21/67

Abstract: A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.

公开(公告)号：US20170323807A1

公开(公告)日：2017-11-09

申请号：US15363334

申请日：2016-11-29

Applicant: K.C.Tech Co., Ltd.

Inventor： Young Kyu Kweon ,  Joon Ho An ,  Byoung Chaul Son ,  Jin Sung Rho

IPC: H01L21/67 ,  H01L21/673

CPC classification number: H01L21/67023 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67075 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/67288 ,  H01L21/67326 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68707

Abstract: Provided is a substrate processing system and a substrate processing method. The substrate processing system includes a polishing part for performing a Chemical Mechanical Polishing (CMP) process on a substrate, a cleaning part for cleaning the substrate on which the polishing process is performed, and a substrate transferring part for transferring the substrate to the cleaning part before polishing the substrate in the polishing part. The substrate may be preparatorily cleaned in the cleaning part before the polishing process, and then enters the polishing part.

公开(公告)号：US20170320188A1

公开(公告)日：2017-11-09

申请号：US15373703

申请日：2016-12-09

Applicant: K.C.Tech Co., Ltd.

Inventor： Young Kyu Kweon ,  Byoung Chaul Son ,  Moon Gi Cho ,  Joon Ho An

IPC: B24B37/20 ,  H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B3/12 ,  B08B3/08 ,  H01L21/306

Abstract: A substrate processing system comprising a polishing part, a pre-cleaning region, and a cleaning part. The polishing part performs a Chemical Mechanical Polishing (CMP) process on a substrate. The pre-cleaning region is prepared in the polishing part and allows pre-cleaning performed on the substrate having undergone the polishing process. The cleaning part cleans the substrate pre-cleaned in the pre-cleaning region.