Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board
    1.
    发明授权
    Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board 有权
    要进行臭氧处理的树脂板,布线板和制造布线板的方法

    公开(公告)号:US08784638B2

    公开(公告)日:2014-07-22

    申请号:US13654873

    申请日:2012-10-18

    摘要: A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect. Thus, the adhesion strength of the plating film is improved even where the resin-metal composite layer has a thickness of 10 to 200 nm.

    摘要翻译: 一种树脂板,由至少一种具有与臭氧溶液侵蚀不同程度的树脂的混合物中的至少一种组成,以及分子中具有不同程度的多种成分的树脂 用臭氧水处理对臭氧溶液的腐蚀的敏感性,形成重整层,催化剂金属被重整层吸附,形成进行电镀处理的树脂金属复合层。 在树脂板中,可能被臭氧溶液侵蚀的成分或成分溶解在臭氧溶液中,在成分和成分之间形成有数毫米级的孔或间隙 这是/不太可能被臭氧解决方案所侵蚀。 随着电镀沉积在孔隙或间隙中,由于锚定效应,粘合强度得到改善。 因此,即使在树脂 - 金属复合层的厚度为10〜200nm的情况下,也能够提高镀膜的附着强度。