公开(公告)号：US20180332713A1

公开(公告)日：2018-11-15

申请号：US16042947

申请日：2018-07-23

申请人： Averatek Corporation

发明人： Mihir Reddy ,  Michael Riley Vinson ,  Sunity K. Sharma

IPC分类号： H05K3/18 ,  C23C18/20 ,  C23C18/16 ,  C23C18/18 ,  C23C18/38 ,  C23C18/32 ,  C23C18/30 ,  C23C18/00

CPC分类号： H05K3/184 ,  C23C18/00 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1817 ,  C23C18/1841 ,  C23C18/1844 ,  C23C18/1865 ,  C23C18/1889 ,  C23C18/1893 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/32 ,  C23C18/38 ,  H05K2203/0565 ,  H05K2203/125

摘要： Devices produced by patterning electroless metals on a substrate are presented. An active catalyst layer on the substrate is covered with a patterned mask and treated with a deactivating chemical reagent, which deactivates the catalyst layer not covered by the mask. Once the patterned mask is removed, the electroless metal layer can be placed to have a patterned electroless metals. Alternatively, a substrate can be coated with a blocking reagent in a pattern first to inhibit formation of the catalyst layer before a catalyst layer can be placed over the blocking agent layer and then electroless metal layer is placed on the catalyst layer. The pattern of the blocking reagent acts as a negative pattern of the final conductive line pattern.

公开(公告)号：US09512522B2

公开(公告)日：2016-12-06

申请号：US14315166

申请日：2014-06-25

申请人： SHENZHEN BYD AUTO R&D COMPANY LIMITED ,  BYD COMPANY LIMITED

发明人： Weifeng Miao

IPC分类号： C23C18/18 ,  C25D5/02 ,  C23C18/20 ,  C23C18/16 ,  H05K1/09 ,  H05K3/24 ,  C23C28/00 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  H05K3/18

CPC分类号： C23C18/1882 ,  C09D11/037 ,  C09D11/322 ,  C09D11/52 ,  C23C18/1608 ,  C23C18/1639 ,  C23C18/165 ,  C23C18/1865 ,  C23C18/1879 ,  C23C18/2033 ,  C23C18/206 ,  C23C28/00 ,  C25D5/02 ,  H05K1/097 ,  H05K3/18 ,  H05K3/246 ,  H05K2203/1105

摘要： A mthod of metalizing a surface of an insulation substrate includes: applying an ink composition onto the surface to form an ink layer; subjecting the insulation substrate to heat treatment at a temperature of about 500 to 1000 degrees Celsius in a non-reactive atmosphere; plating a metal layer on the ink layer. The ink composition comprises a metal compound and an ink vehicle. The metal compound includes at least one selected from a group consisting of a nano-copper oxide, a nano-cuprous oxide, a compound of formula I, and a compound of formula II, TiO2-σ(I), M1M2pOq (II), 0.05≦σ

摘要翻译： 金属化绝缘基板的表面的正面包括：将油墨组合物施加到表面上以形成油墨层; 使绝缘基板在非反应性气氛中在约500至1000摄氏度的温度下进行热处理; 在油墨层上镀金属层。 油墨组合物包含金属化合物和油墨载体。 金属化合物包括选自纳米氧化铜，纳米氧化亚铜，式I化合物和式II化合物的至少一种，TiO 2-σ（I），M1M2pOq（II）， 0.05≤σ<1.8，其中，M1为选自周期表第2,9-12族的元素中的至少一种元素，M2为选自3-8,10和10族中的至少一种元素， 周期表13，0

公开(公告)号：US09506148B2

公开(公告)日：2016-11-29

申请号：US14451573

申请日：2014-08-05

申请人： NATIONAL CHENG KUNG UNIVERSITY

发明人： In-Gann Chen ,  Chang-Shu Kuo ,  Hung-Tao Chen ,  Pei-Ying Hsieh

IPC分类号： B05D3/06 ,  B05D3/10 ,  C23C18/16 ,  D01D5/00 ,  C23C18/31 ,  D06M11/83 ,  D01F1/10 ,  C23C18/20 ,  C23C18/30 ,  C23C18/44

CPC分类号： C23C18/1633 ,  C23C18/1641 ,  C23C18/2033 ,  C23C18/30 ,  C23C18/31 ,  C23C18/44 ,  D01D5/003 ,  D01F1/10 ,  D06M11/83

摘要： A method for forming a flexible transparent conductive film includes steps of: (a) electrospinning a first solution, which contains a polymer, a solvent and a metal ion-containing precursor, to form an polymeric fiber onto a soluble substrate; (b) providing energy to reduce the metal ion-containing precursor of the polymeric fiber, so as to form metal seeds on the polymeric fiber; and (c) placing the polymeric fiber together with the soluble substrate into a second solution, such that the soluble substrate dissolves in the second solution to form an electroless-plating bath and such that the polymeric fiber is subjected to electroless plating to form a metal coating from the metal seeds.

摘要翻译： 用于形成柔性透明导电膜的方法包括以下步骤：（a）将含有聚合物，溶剂和含金属离子的前体的第一溶液电纺丝以在可溶性基材上形成聚合物纤维; （b）提供能量以减少聚合物纤维的含金属离子的前体，以便在聚合物纤维上形成金属种子; 和（c）将聚合物纤维与可溶性底物一起放入第二溶液中，使得可溶性底物溶解在第二溶液中以形成化学镀浴，并且使得聚合物纤维经受化学镀以形成金属 从金属种子涂覆。

公开(公告)号：US09023560B1

公开(公告)日：2015-05-05

申请号：US14072049

申请日：2013-11-05

申请人： Mark Edward Irving ,  Thomas B. Brust

发明人： Mark Edward Irving ,  Thomas B. Brust

IPC分类号： C23C18/20 ,  G03F7/26 ,  G03F7/40

CPC分类号： C23C18/204 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/2033 ,  C23C18/206 ,  C23C18/285 ,  C23C18/30 ,  G03F7/038 ,  G03F7/0392 ,  G03F7/265 ,  G03F7/38 ,  G03F7/40 ,  G03F7/405 ,  Y10T428/24802

摘要： A conductive pattern is formed in a polymeric layer that has (a) a reactive polymer comprising pendant tertiary alkyl ester groups, (b) a compound that provides an acid upon exposure to radiation, and (c) a crosslinking agent. The polymeric layer is patternwise exposed to radiation to provide a polymeric layer comprising non-exposed regions and exposed regions comprising a polymer comprising carboxylic acid groups. The exposed regions are contacted with electroless seed metal ions to form a pattern of electroless seed metal ions. This pattern of electroless seed metal ions can be contacted with a non-reducing reagent that reacts with the electroless seed metal ions to form an electroless seed metal compound that has a pKsp of less than 40. This bound electroless seed metal compound is then electrolessly plated with a suitable conductive metal.

摘要翻译： 导电图案形成在聚合物层中，该聚合物层具有（a）包含叔烷基酯基侧基的反应性聚合物，（b）暴露于辐射时提供酸的化合物，和（c）交联剂。 将聚合物层图案地暴露于辐射以提供包含非暴露区域的聚合物层和包含包含羧酸基团的聚合物的暴露区域。 暴露的区域与无电子种子金属离子接触以形成无电子种子金属离子的图案。 无电子种子金属离子的这种图案可以与非还原试剂接触，其与无电子种子金属离子反应形成pKsp小于40的化学金属化合物。然后将该结合的无电子种子金属化合物无电镀 具有合适的导电金属。

公开(公告)号：US20140370313A1

公开(公告)日：2014-12-18

申请号：US14362604

申请日：2012-12-05

申请人： Atotech Deutschland GmbH

发明人： Thomas Thomas ,  Lutz Brandt ,  Lutz Stamp ,  Hans-Jürgen Schreier

IPC分类号： C23C28/00 ,  C23C18/18 ,  C25D7/12 ,  C25D5/54

CPC分类号： C23C28/345 ,  B82Y30/00 ,  C23C18/165 ,  C23C18/1653 ,  C23C18/18 ,  C23C18/1865 ,  C23C18/1893 ,  C23C18/2033 ,  C23C18/2066 ,  C25D5/54 ,  C25D7/12 ,  H05K3/389

摘要： A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.

摘要翻译： 提供了一种用于金属化衬底的方法，其提供沉积的金属对衬底材料的高粘附性，从而形成耐用的结合。 该方法在金属化之前应用包含纳米尺寸颗粒的新型粘合促进剂。 颗粒具有至少一个具有适于结合底物的功能性化学基团的连接基团。

公开(公告)号：US20140366805A1

公开(公告)日：2014-12-18

申请号：US13917924

申请日：2013-06-14

申请人： Israel Schuster

发明人： Israel Schuster

IPC分类号： H05K3/46

CPC分类号： H05K3/4688 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1817 ,  C23C18/182 ,  C23C18/1831 ,  C23C18/1865 ,  C23C18/1868 ,  C23C18/1879 ,  C23C18/2033 ,  C23C18/204 ,  C23C18/30 ,  C23C18/54 ,  H05K3/182 ,  H05K3/185 ,  H05K2201/0145 ,  H05K2203/107

摘要： A system or apparatus for forming a conductive pattern on a substrate (208) includes a thermal imaging head (220) that forms an image pattern on the substrate. A functional material (240) spraying element (224) applies a functional material on the substrate which bonds with the image pattern. The spraying element is integrated in the thermal imaging head. An electro-less deposition element is applied using the electro-less deposition element on the substrate to enhance the functionality of the final product.

摘要翻译： 用于在衬底（208）上形成导电图案的系统或设备包括在衬底上形成图像图案的热成像头（220）。 功能材料（240）喷涂元件（224）将功能材料施加在与图像图案粘结的基板上。 喷射元件集成在热成像头中。 使用基板上的无电沉积元件施加无电沉积元件以增强最终产品的功能。

公开(公告)号：US20130037513A1

公开(公告)日：2013-02-14

申请号：US13654873

申请日：2012-10-18

申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA ,  KABUSHIKI KAISHA TOYOTA JIDOSHOKKI

发明人： Takeshi BESSHO ,  Kyoko KUMAGAI ,  Takashi YOSHIDA ,  Manabu OSAMURA ,  Toshihisa SHIMO

IPC分类号： H05K3/10

CPC分类号： C23C18/2086 ,  C23C18/1653 ,  C23C18/1694 ,  C23C18/2006 ,  C23C18/2033 ,  H05K3/181 ,  H05K3/381 ,  H05K2203/087

摘要： A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect. Thus, the adhesion strength of the plating film is improved even where the resin-metal composite layer has a thickness of 10 to 200 nm.

摘要翻译： 一种树脂板，由至少一种具有与臭氧溶液侵蚀不同程度的树脂的混合物中的至少一种组成，以及分子中具有不同程度的多种成分的树脂 用臭氧水处理对臭氧溶液的腐蚀的敏感性，形成重整层，催化剂金属被重整层吸附，形成进行电镀处理的树脂金属复合层。 在树脂板中，可能被臭氧溶液侵蚀的成分或成分溶解在臭氧溶液中，在成分和成分之间形成有数毫米级的孔或间隙 这是/不太可能被臭氧解决方案所侵蚀。 随着电镀沉积在孔隙或间隙中，由于锚定效应，粘合强度得到改善。 因此，即使在树脂 - 金属复合层的厚度为10〜200nm的情况下，也能够提高镀膜的附着强度。

公开(公告)号：US08187677B2

公开(公告)日：2012-05-29

申请号：US12428984

申请日：2009-04-23

申请人： Demitrios Roumonis

发明人： Demitrios Roumonis

IPC分类号： B05D3/08 ,  B05D7/00

CPC分类号： B05D5/068 ,  C23C18/165 ,  C23C18/1658 ,  C23C18/2033 ,  C23C18/2066 ,  C23C18/44 ,  Y10T428/31609

摘要： A process for electroless silver plating of a work piece includes simultaneously spraying a silver nitrate solution and a reducer on a work piece to form a reflective layer on the work piece, applying a water-based urethane coating on the reflective layer, and applying either a top coat that is solvent based or a powder based on the water-based urethane coating.

摘要翻译： 工件的无电镀银工艺包括在工件上同时喷涂硝酸银溶液和还原剂，在工件上形成反射层，在反射层上涂覆水性聚氨酯涂层， 基于溶剂的面漆或基于水基聚氨酯涂层的粉末。

公开(公告)号：US20100059259A1

公开(公告)日：2010-03-11

申请号：US12531886

申请日：2008-05-21

申请人： Takeshi Bessho ,  Kyoko Kumagai ,  Takashi Yoshida ,  Manabu Osamura ,  Toshihisa Shimo

发明人： Takeshi Bessho ,  Kyoko Kumagai ,  Takashi Yoshida ,  Manabu Osamura ,  Toshihisa Shimo

IPC分类号： H05K1/09 ,  C08G18/00 ,  C25D5/34 ,  H01B13/00

CPC分类号： C23C18/2086 ,  C23C18/1653 ,  C23C18/1694 ,  C23C18/2006 ,  C23C18/2033 ,  H05K3/181 ,  H05K3/381 ,  H05K2203/087

摘要： A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect. Thus, the adhesion strength of the plating film is improved even where the resin-metal composite layer has a thickness of 10 to 200 nm.

摘要翻译： 一种树脂板，由至少一种具有与臭氧溶液侵蚀不同程度的树脂的混合物中的至少一种组成，以及分子中具有不同程度的多种成分的树脂 用臭氧水处理对臭氧溶液的腐蚀的敏感性，形成重整层，催化剂金属被重整层吸附，形成进行电镀处理的树脂金属复合层。 在树脂板中，可能被臭氧溶液侵蚀的成分或成分溶解在臭氧溶液中，在成分和成分之间形成有数毫米级的孔或间隙 这是/不太可能被臭氧解决方案所侵蚀。 随着电镀沉积在孔隙或间隙中，由于锚定效应，粘合强度得到改善。 因此，即使在树脂 - 金属复合层的厚度为10〜200nm的情况下，也能够提高镀膜的附着强度。

公开(公告)号：US07182995B2

公开(公告)日：2007-02-27

申请号：US10526929

申请日：2003-09-09

申请人： Koji Muto ,  Hiroshi Hayami ,  Yoshito Sakamoto ,  Shinya Nishikawa ,  Shohei Okabe

发明人： Koji Muto ,  Hiroshi Hayami ,  Yoshito Sakamoto ,  Shinya Nishikawa ,  Shohei Okabe

IPC分类号： B32B15/09 ,  B32B15/20 ,  B32B27/16 ,  B32B27/20 ,  B32B27/36

CPC分类号： H01L21/4857 ,  C08J7/045 ,  C08J2367/02 ,  C23C18/2033 ,  C23C18/208 ,  Y10T428/24355 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/25 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/264 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  Y10T428/31794

摘要： Disclosed herein is a plated-polyester article with a plating layer formed on the surface of a polyester article. The polyester article is irradiated with ionizing radiation to crosslink a polyester resin, the arithmetic mean roughness Ra of the surface of the plating layer is at most 1 μm, and adhesion strength between the polyester article and the plating layer is at least 2 MPa. A production process of a plated-polyester article, which comprises the step of melt-forming a resin composition obtained by dispersing an inorganic filler having an average particle diameter of 1 to 10 μm in a proportion of 5 to 20 vol. % in a polyester resin, which can be crosslinked by irradiation with ionizing radiation, into a polyester article, is also disclosed.

摘要翻译： 本文公开了一种镀聚酯制品，其在聚酯制品的表面上形成镀层。 聚酯制品用电离辐射照射以交联聚酯树脂，镀层表面的算术平均粗糙度Ra至多为1μm，聚酯制品和镀层之间的粘合强度至少为2MPa。 电镀聚酯制品的制造方法，其特征在于，包括将平均粒径为1〜10μm的无机填料以5〜20体积％的比例分散而成的树脂组合物熔融成形工序。 还公开了可以通过用电离辐射照射而交联的聚酯树脂中的％的聚酯树脂。