公开(公告)号：US20190133423A1

公开(公告)日：2019-05-09

申请号：US15804261

申请日：2017-11-06

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Naushad Kasim ,  Margus Lohk ,  Indrek-Toomas Polluks

IPC: A61B1/04 ,  G01J1/02 ,  G01J1/42 ,  G01J1/04

CPC classification number: A61B1/04 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/00188 ,  A61B1/051 ,  G01J1/0271 ,  G01J1/0477 ,  G01J1/42

Abstract: An image sensor module includes a circuit board, an image sensor, and a turning prism. The circuit board has first and second side sections each extending in a respective plane transverse to a plane of a center section to define a module interior volume. The image sensor has a bottom plane mounted on an inner face of the circuit board within the module interior volume. The turning prism has a mounting surface secured to a top plane of the image sensor. An electronic component arrangement is operatively mounted on the inner face of the circuit board between the image sensor and a circuit board rearward end. A number of wires providing power and data connections to the circuit board are operatively connected to contacts located on the circuit board in the interior volume between the electronic component arrangement and the circuit board rearward end.

公开(公告)号：US10524643B2

公开(公告)日：2020-01-07

申请号：US15804261

申请日：2017-11-06

Applicant: KARL STORZ Endovision, Inc.

Inventor： Dashiell Birnkrant ,  Naushad Kasim ,  Margus Lohk ,  Indrek-Toomas Polluks

IPC: A61B1/04 ,  G01J1/02 ,  G01J1/04 ,  G01J1/42 ,  A61B1/00

Abstract: An image sensor module includes a circuit board, an image sensor, and a turning prism. The circuit board has first and second side sections each extending in a respective plane transverse to a plane of a center section to define a module interior volume. The image sensor has a bottom plane mounted on an inner face of the circuit board within the module interior volume. The turning prism has a mounting surface secured to a top plane of the image sensor. An electronic component arrangement is operatively mounted on the inner face of the circuit board between the image sensor and a circuit board rearward end. A number of wires providing power and data connections to the circuit board are operatively connected to contacts located on the circuit board in the interior volume between the electronic component arrangement and the circuit board rearward end.