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公开(公告)号:US20120238074A1
公开(公告)日:2012-09-20
申请号:US13188824
申请日:2011-07-22
申请人: KARTIK SANTHANAM , MARTIN A. HILKENE , MANOJ VELLAIKAL , MARK R. LEE , MATTHEW D. SCOTNEY-CASTLE , PETER I. PORSHNEV
发明人: KARTIK SANTHANAM , MARTIN A. HILKENE , MANOJ VELLAIKAL , MARK R. LEE , MATTHEW D. SCOTNEY-CASTLE , PETER I. PORSHNEV
IPC分类号: H01L21/265 , H01L21/326
CPC分类号: H01L21/2236 , H01J37/32412 , H01J37/32623 , H01J37/32669 , H01L21/324
摘要: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a method of doping a substrate may include forming a dopant region on a substrate by implanting one or more dopant elements into the dopant region of the substrate using a plasma doping process; forming a cap layer atop the dopant region; annealing the dopant region after forming the cap layer; and removing the cap layer after annealing the dopant region.
摘要翻译: 本文提供了用于处理衬底的方法和设备。 在一些实施例中,掺杂衬底的方法可以包括通过使用等离子体掺杂工艺将一个或多个掺杂剂元素注入到衬底的掺杂剂区域中在衬底上形成掺杂剂区域; 在掺杂剂区域的顶部形成帽层; 在形成盖层之后退火掺杂剂区域; 并且在退火掺杂剂区域之后去除覆盖层。
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公开(公告)号:US20130095643A1
公开(公告)日:2013-04-18
申请号:US13274776
申请日:2011-10-17
IPC分类号: H01L21/265
CPC分类号: H01L21/2236 , H01J37/32412
摘要: Methods for processing a substrate are provided herein. In some embodiments, a method of processing a substrate may include implanting a dopant species into the one or more regions of the substrate using a first dopant precursor comprising a hydride of the dopant species; and implanting the dopant species into the one or more regions of the substrate using a second dopant precursor comprising fluorine and the dopant species. In some embodiments, the first and second dopant precursors may be provided simultaneously. In some embodiments, the first dopant precursor may be provided for a first time period, followed by providing the first dopant precursor and the second dopant precursor for a second period of time. In some embodiments, the flow of the first dopant precursor and the flow of the second dopant precursor may be alternated until a desired implant level is reached.
摘要翻译: 本文提供了处理基板的方法。 在一些实施例中,处理衬底的方法可以包括使用包含掺杂剂物质的氢化物的第一掺杂剂前体将掺杂剂物质注入衬底的一个或多个区域; 以及使用包含氟和所述掺杂剂物质的第二掺杂剂前体将所述掺杂剂物质注入到所述衬底的所述一个或多个区域中。 在一些实施方案中,可以同时提供第一和第二掺杂剂前体。 在一些实施方案中,可以在第一时间段内提供第一掺杂剂前体,随后在第二时间段内提供第一掺杂剂前体和第二掺杂剂前体。 在一些实施方案中,第一掺杂剂前体的流动和第二掺杂剂前体的流动可以交替,直到达到期望的植入水平。
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公开(公告)号:US20120088356A1
公开(公告)日:2012-04-12
申请号:US13227034
申请日:2011-09-07
申请人: KARTIK SANTHANAM , MARTIN A. HILKENE , MATTHEW D. SCOTNEY-CASTLE , PETER I. PORSHNEV , SWAMINATHAN SRINIVASAN , SUNDAR RAMAMURTHY
发明人: KARTIK SANTHANAM , MARTIN A. HILKENE , MATTHEW D. SCOTNEY-CASTLE , PETER I. PORSHNEV , SWAMINATHAN SRINIVASAN , SUNDAR RAMAMURTHY
IPC分类号: H01L21/265
CPC分类号: H01L21/2236 , H01L21/324 , H01L21/67207
摘要: An integrated platform for processing substrates, comprising: a vacuum substrate transfer chamber; a doping chamber coupled to the vacuum substrate transfer chamber, the doping chamber configured to implant or deposit dopant elements in or on a surface of a substrate; a dopant activation chamber coupled to the vacuum substrate transfer chamber, the dopant activation chamber configured to anneal the substrate and activate the dopant elements; and a controller configured to control the integrated platform, the controller comprising a computer readable media having instructions stored thereon that, when executed by the controller, causes the integrated platform to perform a method, the method comprising: doping a substrate with one or more dopant elements in the doping chamber; transferring the substrate under vacuum to the dopant activation chamber; and annealing the substrate in the dopant activation chamber to activate the dopant elements.
摘要翻译: 一种用于处理衬底的集成平台,包括:真空衬底传送室; 耦合到所述真空衬底传送室的掺杂室,所述掺杂室被配置为将掺杂元素注入或沉积在衬底的表面中或其上; 掺杂剂激活室,其耦合到所述真空衬底传送室,所述掺杂剂激活室被配置为退火所述衬底并激活所述掺杂元素; 以及控制器,其被配置为控制所述集成平台,所述控制器包括具有存储在其上的指令的计算机可读介质,当由所述控制器执行时,所述控制器使所述集成平台执行方法,所述方法包括:将衬底与一个或多个掺杂剂 掺杂室中的元素; 将衬底真空转移到掺杂剂活化室; 以及退火所述掺杂剂激活室中的所述衬底以激活所述掺杂元素。
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