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公开(公告)号：US20230025469A1
公开(公告)日：2023-01-26
申请号：US17863489
申请日：2022-07-13
Applicant: KCTECH CO., LTD.
Inventor： Jeong Gyu LEE , Hyo Jun Jang , Jun Ha Hwang
IPC: H01L21/321 , C01F17/235
Abstract: Provided is a new cerium-based particle and a polishing slurry composition including the same. The new cerium-based particle may include a self-assembly of fine particles and an organic material.
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