公开(公告)号：US20230025469A1

公开(公告)日：2023-01-26

申请号：US17863489

申请日：2022-07-13

Applicant: KCTECH CO., LTD.

Inventor： Jeong Gyu LEE ,  Hyo Jun Jang ,  Jun Ha Hwang

IPC: H01L21/321 ,  C01F17/235

Abstract: Provided is a new cerium-based particle and a polishing slurry composition including the same. The new cerium-based particle may include a self-assembly of fine particles and an organic material.

公开(公告)号：US20230072716A1

公开(公告)日：2023-03-09

申请号：US17897222

申请日：2022-08-29

Applicant: KCTECH CO., LTD.

Inventor： Jung Hun KIM ,  Jeong Gyu LEE ,  Hyo Jun JANG

IPC: C09K3/14 ,  C09G1/02

Abstract: The present disclosure relates to cerium oxide abrasive particles and a polishing slurry composition, and more particularly, to cerium oxide abrasive particles comprising: an element cerium; and a modifier and satisfying the agglomeration ratios calculated from the relational expressions of the primary particle sizes and the secondary particle sizes, and a polishing slurry composition comprising the same.