-
公开(公告)号：US20230339070A1
公开(公告)日：2023-10-26
申请号：US18136834
申请日：2023-04-19
Applicant: KCTECH CO., LTD.
Inventor： Ki Hyuk YANG , Sang Jeong WOO
CPC classification number: B24B49/14 , B24B49/045 , B24B7/04
Abstract: Provided is a high-precision substrate polishing system. An apparatus for polishing a substrate includes a platen on which a polishing pad is seated and which is rotatable, a substrate carrier configured to grip a substrate and rotatable on an upper side of the platen, an infrared sensor located inside the platen and configured to measure a temperature of the substrate, and a controller configured to determine a polishing state of the substrate using a value measured by the infrared sensor.
Search Results
1
records
(took 0.01 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
