公开(公告)号：US20240066657A1

公开(公告)日：2024-02-29

申请号：US18140977

申请日：2023-04-28

Applicant: KCTECH CO., LTD.

Inventor： Ji Hoon SON ,  Jeong Heon HAN ,  Ki Hyuk YANG

IPC: B24B37/005 ,  G01B11/06 ,  G01N21/31 ,  G06N3/08

CPC classification number: B24B37/005 ,  G01B11/06 ,  G01N21/31 ,  G06N3/08

Abstract: Provided are a control method, a control apparatus, a training method, and a training apparatus based on thickness estimation of a wafer substrate. The training method includes generating a training spectrum signal according to a thickness of a wafer substrate using an optical model, generating a training spectrum signal having a noise by applying a noise based on a noise parameter to the training spectrum signal, calculating a similarity between the training spectrum signal having the noise and an actually measured spectrum signal, and when the similarity satisfies a set condition, training a noise reduction model using the training spectrum signal having the noise.

公开(公告)号：US20230339070A1

公开(公告)日：2023-10-26

申请号：US18136834

申请日：2023-04-19

Applicant: KCTECH CO., LTD.

Inventor： Ki Hyuk YANG ,  Sang Jeong WOO

IPC: B24B49/14 ,  B24B49/04 ,  B24B7/04

CPC classification number: B24B49/14 ,  B24B49/045 ,  B24B7/04

Abstract: Provided is a high-precision substrate polishing system. An apparatus for polishing a substrate includes a platen on which a polishing pad is seated and which is rotatable, a substrate carrier configured to grip a substrate and rotatable on an upper side of the platen, an infrared sensor located inside the platen and configured to measure a temperature of the substrate, and a controller configured to determine a polishing state of the substrate using a value measured by the infrared sensor.