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公开(公告)号:US20240096562A1
公开(公告)日:2024-03-21
申请号:US18367242
申请日:2023-09-12
Applicant: KEMET Electronics Corporation
Inventor: Brandon K. Summey , Jeffrey Poltorak , Robert Andrew Ramsbottom , Kevin A. Agosto
CPC classification number: H01G9/012 , H01G9/0029 , H01G9/0425 , H01G9/08 , H01G9/15
Abstract: Provided herein is an improved capacitor. The capacitor comprises a capacitor body comprising an anode, a dielectric on the anode and a cathode on the dielectric. At least two anode wires are in electrical contact with the anode and extending from the capacitor body. At least one anode node, or an anode node remnant, wherein each anode wire of the anode wires is in electrical contact with at least one anode node or anode remnant. An encapsulant encases the capacitor body. At least a portion of the anode node, or anode node remnant, is in electrical connection with an external termination. A cathode external termination is in electrical contact with the cathode.
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公开(公告)号:US20230065146A1
公开(公告)日:2023-03-02
申请号:US17462459
申请日:2021-08-31
Applicant: KEMET Electronics Corporation
Inventor: Brandon Summey , Jeffrey Poltorak , Robert Andrew Ramsbottom , Kevin A. Agosto
Abstract: An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with
a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.-
公开(公告)号:US11869727B2
公开(公告)日:2024-01-09
申请号:US17462459
申请日:2021-08-31
Applicant: KEMET Electronics Corporation
Inventor: Brandon Summey , Jeffrey Poltorak , Robert Andrew Ramsbottom , Kevin A. Agosto
Abstract: An improved capacitor, and method of making the capacitor, is described. The capacitor comprises an upper reinforced encapsulant layer and a lower reinforced encapsulant layer with
a capacitive element between the upper reinforced encapsulant layer and lower reinforced encapsulant layer. The capacitive element comprises an anode, a dielectric on the anode and a cathode on the dielectric. An internal reinforced encapsulant layer is between the upper reinforced encapsulant layer and lower reinforced encapsulant layer.
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