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公开(公告)号:US20120199071A1
公开(公告)日:2012-08-09
申请号:US13446732
申请日:2012-04-13
申请人: KENNETH S. COLLINS , Andrew N. Nguyen , Kartik Ramaswamy , Hiroji Hanawa , Douglas A. Buchberger, JR. , Daniel J. Hoffman , Amir Al-Bayati
发明人: KENNETH S. COLLINS , Andrew N. Nguyen , Kartik Ramaswamy , Hiroji Hanawa , Douglas A. Buchberger, JR. , Daniel J. Hoffman , Amir Al-Bayati
IPC分类号: C23C16/455 , C23C16/50
CPC分类号: H01J37/32458 , H01J37/32412 , H01J37/32477
摘要: Embodiments described herein relate to a plasma chamber and processing system utilizing robust components. In one embodiment, a chamber is provided. The chamber includes a body having an interior volume, a gas distribution assembly disposed in the interior volume opposing a substrate support, the gas distribution assembly having a coolant channel disposed thereon, and a first hollow conduit and a second hollow conduit coupled to the body and in fluid communication with the interior volume.
摘要翻译: 本文所述的实施例涉及使用鲁棒部件的等离子体室和处理系统。 在一个实施例中,提供了一个室。 所述腔室包括具有内部体积的本体,设置在所述内部体积中与衬底支撑件相对的气体分配组件,所述气体分配组件具有设置在其上的冷却剂通道,以及联接到所述主体的第一中空导管和第二中空导管, 与内部容积流体连通。
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公开(公告)号:US20080173237A1
公开(公告)日:2008-07-24
申请号:US12016810
申请日:2008-01-18
申请人: Kenneth S. Collins , Andrew N. Nguyen , Kartik Ramaswamy , Hiroji Hanawa , Douglas A. Buchberger , Daniel J. Hoffman , Amir Al-Bayati
发明人: Kenneth S. Collins , Andrew N. Nguyen , Kartik Ramaswamy , Hiroji Hanawa , Douglas A. Buchberger , Daniel J. Hoffman , Amir Al-Bayati
IPC分类号: C23C16/453
CPC分类号: H01J37/32458 , H01J37/32412 , H01J37/32477
摘要: Embodiments described herein generally provide a toroidal plasma source, a plasma channeling device, a showerhead, and a substrate support assembly for use in a plasma chamber. The toroidal plasma source, plasma channeling device, showerhead, and substrate support assembly are adapted to improve the usable lifetime of the plasma chamber, as well as reduce assembly cost, increase the plasma chamber reliability, and improve device yield on the processed substrates.
摘要翻译: 本文描述的实施例通常提供环形等离子体源,等离子体引导装置,喷头和用于等离子体室的基板支撑组件。 环形等离子体源,等离子体引导装置,喷头和基板支撑组件适于改善等离子体室的使用寿命,并且降低组装成本,增加等离子体室的可靠性,并提高处理的基板上的装置产量。
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