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    Microflow sensor and method of making the same
    3.
    发明授权
    Microflow sensor and method of making the same 有权

    公开(公告)号：US11525721B1

    公开(公告)日：2022-12-13

    申请号：US17835934

    申请日：2022-06-08

    申请人： KING FAISAL UNIVERSITY

    发明人： Saed A. Salman ,  Abdullah Aljaafari ,  Adil Alshoaibi ,  Mohd Al Saleh Al Othoum

    IPC分类号： G01F1/684

    摘要： The microflow sensor includes a base wafer having opposed upper and lower surfaces, and a cap wafer, also having opposed upper and lower surfaces. The base wafer and the cap wafer may be formed from a semiconductor material. A flow sensing element is embedded in the upper surface of the base wafer. The flow sensing element may be any suitable type of flow sensing element, such as a central heater and at least one temperature-sensitive element. A flow channel is formed in the lower surface of the cap wafer and extends continuously between first and second longitudinally opposed edges of the cap wafer. The lower surface of the cap wafer is bonded to the upper surface of the base wafer such that fluid flowing through the flow channel passes above and across the sensing element.