公开(公告)号：US12190966B2

公开(公告)日：2025-01-07

申请号：US17899447

申请日：2022-08-30

Applicant: KIOXIA CORPORATION

Inventor： Tomoya Sanuki ,  Hitomi Tanaka ,  Tatsuro Hitomi ,  Yasuhito Yoshimizu ,  Masayuki Miura ,  Yoshihiro Ohba

IPC: G11C16/26 ,  G11C16/04 ,  G11C16/34 ,  H10B43/00

Abstract: A method of processing a memory system that includes a substrate with a connector and a semiconductor memory chip connected to the connector is provided. The method includes detaching the semiconductor memory chip from the connector, performing an annealing process with respect to the semiconductor memory chip detached from the connector, and after the annealing process, attaching the semiconductor memory chip to the connector on the substrate.

公开(公告)号：US11579796B2

公开(公告)日：2023-02-14

申请号：US17197667

申请日：2021-03-10

Applicant: Kioxia Corporation

Inventor： Tomoya Sanuki ,  Yuta Aiba ,  Hitomi Tanaka ,  Masayuki Miura ,  Mie Matsuo ,  Toshio Fujisawa ,  Takashi Maeda

IPC: G06F3/00 ,  G06F3/06

Abstract: A memory system has a memory, a first substrate on which the memory is mounted and which is set to a temperature of −40[° C.] or lower, a controller configured to control the memory; and a second substrate on which the controller is mounted, which is set to a temperature of −40[° C.] or higher, and which transmits and receives a signal to and from the first substrate via a signal transmission cable.