公开(公告)号：US12172194B2

公开(公告)日：2024-12-24

申请号：US18496222

申请日：2023-10-27

Applicant: KIOXIA CORPORATION

Inventor： Minako Inukai ,  Masatoshi Terayama

IPC: B08B13/00 ,  B08B3/02 ,  H01L21/67

Abstract: A substrate processing apparatus for cleaning and drying a substrate under processing, including supplying a cleaning liquid onto the substrate under processing to form a cleaning liquid layer, supplying a gas onto the substrate under processing to partially remove the cleaning liquid layer and thus generate a first dry region on the substrate under processing, expanding the first dry region to generate a second dry region by controlling the movement speed of the boundary between the cleaning liquid layer and the first dry region to be less than or equal to a predetermined speed, and further expanding the second dry region to generate a third dry region.

公开(公告)号：US11833550B2

公开(公告)日：2023-12-05

申请号：US17695512

申请日：2022-03-15

Applicant: Kioxia Corporation

Inventor： Minako Inukai ,  Masatoshi Terayama

IPC: H01L21/67 ,  B08B13/00 ,  B08B3/02

CPC classification number: B08B13/00 ,  B08B3/02 ,  H01L21/67034 ,  H01L21/67253

Abstract: A substrate processing apparatus for cleaning and drying a substrate under processing, including supplying a cleaning liquid onto the substrate under processing to form a cleaning liquid layer, supplying a gas onto the substrate under processing to partially remove the cleaning liquid layer and thus generate a first dry region on the substrate under processing, expanding the first dry region to generate a second dry region by controlling the movement speed of the boundary between the cleaning liquid layer and the first dry region to be less than or equal to a predetermined speed, and further expanding the second dry region to generate a third dry region.