公开(公告)号：US11249391B2

公开(公告)日：2022-02-15

申请号：US15909491

申请日：2018-03-01

Applicant: KIOXIA CORPORATION

Inventor： Takashi Kamo ,  Kosuke Takai

IPC: G03F1/54 ,  G03F1/00 ,  G03F1/52 ,  G03F1/22 ,  G03F1/24

Abstract: An exposure mask includes a substrate, and a plurality of first films and a plurality of second films located alternately over each other over selected portions of the substrate. The exposure mask further includes a third film selectively located over the first and second films. At least one first pattern is located over the substrate and does not include any of the first, second or third films. At least one second pattern is located over the substrate and includes the first and second films and does not include the third film. At least one third pattern is located over the substrate and includes the first, second and third films.