MEMS chip, measuring element and pressure sensor for measuring a pressure

    公开(公告)号:US09927316B2

    公开(公告)日:2018-03-27

    申请号:US15024482

    申请日:2014-10-02

    Abstract: A micro-electro-mechanical system (MEMS) chip for measuring a pressure in a pressure space includes a MEMS substrate having a measuring region, a contact-making region connected to the measuring region via lines and having contacts, and a bushing region disposed between the measuring region and the contact-making region. The MEMS substrate defines a cavity formed as a blind hole that defines an opening through one side of the MEMS substrate, the bottom of the blind hole forming a membrane. A measuring bridge includes piezoresistive elements disposed on that side of the membrane which faces away from the cavity's opening. A carrier substrate is disposed over the cavity's opening and bonded to the MEMS substrate in a two-dimensional manner to form a rod, with the result that the carrier substrate forms a bottom wall of the cavity spaced apart from the membrane.

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