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公开(公告)号:US20210383557A1
公开(公告)日:2021-12-09
申请号:US17334179
申请日:2021-05-28
Applicant: KLA Corporation
Inventor: Bjorn Brauer , Huan Jin , Xiaochun Li
Abstract: Methods and systems for determining one or more alignment parameters for use in a process performed on a specimen are provided. One method includes determining measures of similarity between images generated by an imaging system for corresponding locations in each of two or more pairs of dies on a specimen and performing cluster analysis based on the determined measures of similarity to identify the images that are most similar to each other and to assign different subsets of the images that are most similar to each other to different die clusters, respectively. The method also includes separately determining one or more alignment parameters for two or more of the different die clusters. The one or more alignment parameters are used for aligning images generated by the imaging system for the specimen or another specimen to a common reference.
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公开(公告)号:US20250069354A1
公开(公告)日:2025-02-27
申请号:US18480503
申请日:2023-10-04
Applicant: KLA Corporation
Inventor: Hucheng Lee , Huan Jin
IPC: G06V10/24 , G06F9/455 , G06V10/762
Abstract: Methods and systems for alignment for semiconductor applications are provided. One method includes determining different align-to-design offsets for multiple instances of an alignment target formed on a specimen by separately aligning images of the multiple instances of the alignment target generated by an imaging subsystem to a rendered image for the alignment target with different alignment methods, respectively. The method also includes identifying the multiple instances having a difference between the different align-to-design offsets below a predetermined threshold. In addition, the method includes determining a runtime align-to-design offset for the alignment target from the different align-to-design offsets determined for only the identified multiple instances. That runtime align-to-design offset can then be used in a process performed on the specimen with an imaging subsystem.
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3.
公开(公告)号:US20240193798A1
公开(公告)日:2024-06-13
申请号:US18078980
申请日:2022-12-11
Applicant: KLA Corporation
Inventor: Jun Jiang , Huan Jin , Zhifeng Huang , Wei Si , Xiaochun Li
CPC classification number: G06T7/344 , G06T7/001 , G06T11/00 , G06T2207/30148 , G06T2207/30168
Abstract: Methods and systems for determining information for a specimen are provided. One system includes a model configured for generating a rendered image for an alignment target on a specimen from information for a design of the alignment target. The rendered image is a simulation of images of the alignment target on the specimen generated by an imaging subsystem. The system also includes a computer subsystem configured for modifying parameter(s) of the model based on variation in parameter(s) of the imaging subsystem and/or variation in process condition(s) used to fabricate the specimen. Subsequent to the modifying, the computer subsystem is configured for 10 generating an additional rendered image for the alignment target by inputting the information for the design of the alignment target into the model and aligning the additional rendered image to an image of the alignment target generated by the imaging subsystem.
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公开(公告)号:US11328435B2
公开(公告)日:2022-05-10
申请号:US17334179
申请日:2021-05-28
Applicant: KLA Corporation
Inventor: Bjorn Brauer , Huan Jin , Xiaochun Li
Abstract: Methods and systems for determining one or more alignment parameters for use in a process performed on a specimen are provided. One method includes determining measures of similarity between images generated by an imaging system for corresponding locations in each of two or more pairs of dies on a specimen and performing cluster analysis based on the determined measures of similarity to identify the images that are most similar to each other and to assign different subsets of the images that are most similar to each other to different die clusters, respectively. The method also includes separately determining one or more alignment parameters for two or more of the different die clusters. The one or more alignment parameters are used for aligning images generated by the imaging system for the specimen or another specimen to a common reference.
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公开(公告)号:US11803960B2
公开(公告)日:2023-10-31
申请号:US17355126
申请日:2021-06-22
Applicant: KLA Corporation
Inventor: Huan Jin , Xiaochun Li , Sangbong Park , Zhifeng Huang
CPC classification number: G06T7/001 , H01L22/12 , G06T2207/30148 , G06T2207/30168
Abstract: Global and local alignment energies are used in an image contrast metric. The image contrast metric can be used to find optical targets. Some pixels from a gradient magnitude image and a context range image from an optical image can be used to determine the image contrast metric. A heatmap from the image contrast metrics across part of a wafer can then be used to make a list of targets. Upper and lower confidence values can be applied to rank the available targets.
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