公开(公告)号：US09318395B2

公开(公告)日：2016-04-19

申请号：US13687244

申请日：2012-11-28

Applicant: KLA-TENCOR CORPORATION

Inventor： Cecelia Campochiaro ,  Hong Xiao ,  Michael Van Riet ,  Benjamin James Thomas Clarke ,  Harsh Sinha

IPC: H01J37/31 ,  H01L21/66 ,  H01J37/28

CPC classification number: H01L22/20 ,  H01J37/28 ,  H01J37/31 ,  H01J2237/2817 ,  H01L22/12

Abstract: One embodiment relates to a method of preparation of a sample of a substrate for sub-surface review using a scanning electron microscope apparatus. A defect at a location indicated in a first results file is re-detected, and the location of the defect is marked with at least one discrete marking point having predetermined positioning relative to the location of the defect. The location of the defect may be determined relative to the design for the device, and a cut location and a cut angle may be determined in at least a partly-automated manner using that information. Another embodiment relates to a system for preparing a sample for sub-surface review. Another embodiment relates to a method for marking a defect for review on a target substrate. Other embodiments, aspects and feature are also disclosed.

Abstract translation: 一个实施方案涉及使用扫描电子显微镜装置制备用于亚表面评价的基材的样品的方法。 重新检测在第一结果文件中指示的位置处的缺陷，并且使用至少一个相对于缺陷的位置具有预定定位的离散标记点标记缺陷的位置。 可以相对于设备的设计来确定缺陷的位置，并且可以使用该信息至少部分自动化地确定切割位置和切割角度。 另一实施例涉及一种用于准备用于子表面检查的样品的系统。 另一实施例涉及用于在目标衬底上标记用于复查的缺陷的方法。 还公开了其它实施例，方面和特征。