公开(公告)号：US20180113387A1

公开(公告)日：2018-04-26

申请号：US15730551

申请日：2017-10-11

Applicant: KLA-Tencor Corporation

Inventor： Hong Xiao ,  Nadav Gutman

IPC: G03F7/20 ,  G01N21/95 ,  H01J37/28

Abstract: A system for generating and implementing programmed defects includes a lithography tool configured to form a multi-pattern structure including a first array pattern and a second array pattern on a sample. The first array pattern or the second array pattern contains a programmed defect to differentiate the first array pattern from the second array pattern. The system includes a metrology tool configured to acquire one or more images of the first array pattern and the second array pattern having a field-of-view containing the programmed defect. The system includes a controller including one or more processors. The one or more processors are configured to receive the images of the first array pattern and the second array pattern from the metrology, and determine a metrology parameter associated with the first array pattern or the second array pattern.

公开(公告)号：US09754761B2

公开(公告)日：2017-09-05

申请号：US15162249

申请日：2016-05-23

Applicant: KLA-TENCOR CORPORATION

Inventor： Hong Xiao ,  Christopher Maher

IPC: H01J37/26 ,  H01J37/147 ,  H01J37/20 ,  H01J37/06

CPC classification number: H01J37/1472 ,  H01J37/265 ,  H01J37/28 ,  H01J2237/2817

Abstract: An inspection tool includes a controller that is configured to generate a scan pattern for an electron beam to image areas of interest on the wafer. The scan pattern minimizes dwell time of the electron beam on the surface of the wafer between the areas of interest. At least one stage speed and at least one raster pattern can be selected based on the areas of interest. The controller sends instructions to electron beam optics to direct the electron beam at the areas of interest on the surface of the wafer using the scan pattern.

公开(公告)号：US10768533B2

公开(公告)日：2020-09-08

申请号：US15730551

申请日：2017-10-11

Applicant: KLA-Tencor Corporation

Inventor： Hong Xiao ,  Nadav Gutman

IPC: G03F7/20 ,  G01N21/95 ,  H01J37/28 ,  H01L21/66

Abstract: A system for generating and implementing programmed defects includes a lithography tool configured to form a multi-pattern structure including a first array pattern and a second array pattern on a sample. The first array pattern or the second array pattern contains a programmed defect to differentiate the first array pattern from the second array pattern. The system includes a metrology tool configured to acquire one or more images of the first array pattern and the second array pattern having a field-of-view containing the programmed defect. The system includes a controller including one or more processors. The one or more processors are configured to receive the images of the first array pattern and the second array pattern from the metrology, and determine a metrology parameter associated with the first array pattern or the second array pattern.

公开(公告)号：US10446367B2

公开(公告)日：2019-10-15

申请号：US15969158

申请日：2018-05-02

Applicant: KLA-Tencor Corporation

Inventor： Hong Xiao

IPC: H01J37/26 ,  H01J37/28 ,  H01J37/22 ,  G01B15/00

Abstract: Disclosed are apparatus and methods for performing overlay metrology upon a target having at least two layers formed thereon. A target having a plurality of periodic structures for measuring overlay in at least two overlay directions is provided. A charged particle beam is scanned in a first direction across a plurality of scan swaths of the target and at a first tilt with respect to the target so that each edge of the periodic structures is scanned at an angle. The charged particle beam is scanned in a second direction, which is opposite the first direction, across the plurality of scan swaths and at a second tilt that is 180° from the first tilt. The first and second direction scanning operations are then repeated for different first and second tilts and a different plurality of scan swaths of the target so that the target is scanned symmetrically. Images that are generated by the first and second direction scanning operations are combined to form a combined image, and an overlay error of the target is determined and reported based on analyzing the combined image.

公开(公告)号：US20160155605A1

公开(公告)日：2016-06-02

申请号：US15018104

申请日：2016-02-08

Applicant: KLA-Tencor Corporation

Inventor： Gary Fan ,  David Chen ,  Vivekanand Kini ,  Hong Xiao

IPC: H01J37/28 ,  H01J37/04 ,  H01J37/26

CPC classification number: H01J37/28 ,  G01N23/2251 ,  H01J37/04 ,  H01J37/147 ,  H01J37/261 ,  H01J2237/04 ,  H01J2237/24592 ,  H01J2237/2806 ,  H01J2237/2817

Abstract: A system for adaptive electron beam scanning may include an inspection sub-system configured to scan an electron beam across the surface of a sample. The inspection sub-system may include an electron beam source, a sample stage, a set of electron-optic elements, a detector assembly and a controller communicatively coupled to one or more portions of the inspection sub-system. The controller may assess one or more characteristics of one or more portions of an area of the sample for inspection and, responsive to the assessed one or more characteristics, adjust one or more scan parameters of the inspection sub-system.

Abstract translation: 用于自适应电子束扫描的系统可以包括配置成扫描横跨样品表面的电子束的检查子系统。 检查子系统可以包括电子束源，样本台，一组电子元件，检测器组件和通信地耦合到检查子系统的一个或多个部分的控制器。 控制器可以评估样品区域的一个或多个部分的一个或多个特征以进行检查，并且响应于所评估的一个或多个特性来调整检查子系统的一个或多个扫描参数。

公开(公告)号：US09116109B2

公开(公告)日：2015-08-25

申请号：US14230987

申请日：2014-03-31

Applicant: KLA-Tencor Corporation

Inventor： Hong Xiao ,  Ximan Jiang

IPC: G01N23/00 ,  G01N23/225 ,  H01J37/28 ,  H01J37/26

CPC classification number: G01N23/2251 ,  H01J37/26 ,  H01J37/28 ,  H01J2237/24475 ,  H01J2237/2804 ,  H01J2237/2817

Abstract: One embodiment relates to a method of detecting a buried defect in a target microscopic metal feature. An imaging apparatus is configured to impinge charged particles with a landing energy such that the charged particles, on average, reach a depth within the target microscopic metal feature. In addition, the imaging apparatus is configured to filter out secondary electrons and detect backscattered electrons. The imaging apparatus is then operated to collect the backscattered electrons emitted from the target microscopic metal feature due to impingement of the charged particles. A backscattered electron (BSE) image of the target microscopic metal feature is compared with the BSE image of a reference microscopic metal feature to detect and classify the buried defect. Other embodiments, aspects and features are also disclosed.

Abstract translation: 一个实施例涉及一种检测目标微观金属特征中的埋入缺陷的方法。 成像装置被配置为以带有电荷的颗粒撞击着陆能量，使得带电粒子平均达到目标微观金属特征内的深度。 此外，成像装置被配置为滤除二次电子并检测反向散射电子。 然后操作成像装置以收集由于带电粒子的撞击而从目标微观金属特征发射的背散射电子。 将目标微观金属特征的背散射电子（BSE）图像与参考微观金属特征的BSE图像进行比较，以检测和分类埋藏缺陷。 还公开了其它实施例，方面和特征。

公开(公告)号：US11410830B1

公开(公告)日：2022-08-09

申请号：US16421004

申请日：2019-05-23

Applicant: KLA-Tencor Corporation

Inventor： Hong Xiao ,  Lawrence Muray ,  Nick Petrone ,  John Gerling ,  Abdurrahman Sezginer ,  Alan D. Brodie ,  Kuljit Virk ,  Qiang Q. Zhang ,  Grace Hsiu-Ling Chen

IPC: H01J37/244 ,  H01J37/22 ,  H01J37/28

Abstract: A system is disclosed. In one embodiment, the system includes a scanning electron microscopy sub-system including an electron source configured to generate an electron beam and an electron-optical assembly including one or more electron-optical elements configured to direct the electron beam to the specimen. In another embodiment, the system includes one or more grounding paths coupled to the specimen, the one or more grounding paths configured to generate one or more transmission signals based on one or more received electron beam-induced transmission currents. In another embodiment, the system includes a controller configured to: generate control signals configured to cause the scanning electron microscopy sub-system to scan the portion of the electron beam across a portion of the specimen; receive the transmission signals via the one or more grounding paths; and generate transmission current images based on the transmission signals.

公开(公告)号：US10018579B1

公开(公告)日：2018-07-10

申请号：US15255024

申请日：2016-09-01

Applicant: KLA-Tencor Corporation

Inventor： Sameet K. Shriyan ,  Hong Xiao ,  David Kaz

IPC: G01N23/2254

CPC classification number: G01N23/2254 ,  G01N2223/6116 ,  G01N2223/646

Abstract: A system for measuring cathodoluminescence from a substrate includes an electron beam source configured to generate an electron beam, a sample stage configured to secure a sample and an electron-optical column including a set of electron-optical elements to direct at least a portion of the electron beam through onto a portion of the sample. The system also includes a set of guide optics located at a position within or below the electron-optical column and a set of collection optics, wherein the set of guide optics captures cathodoluminescent light emitted from the sample in response to the electron beam and directs the cathodoluminescent light to the set of collection optics. In addition, the system includes a detector. The set of collection optics is configured to image the cathodoluminescent light onto the detector.

公开(公告)号：US09734987B2

公开(公告)日：2017-08-15

申请号：US15018104

申请日：2016-02-08

Applicant: KLA-Tencor Corporation

Inventor： Gary Fan ,  David Chen ,  Vivekanand Kini ,  Hong Xiao

IPC: H01J37/28 ,  H01J37/21 ,  G01N23/225 ,  H01J37/147 ,  H01J37/04 ,  H01J37/26

CPC classification number: H01J37/28 ,  G01N23/2251 ,  H01J37/04 ,  H01J37/147 ,  H01J37/261 ,  H01J2237/04 ,  H01J2237/24592 ,  H01J2237/2806 ,  H01J2237/2817

Abstract: A system for adaptive electron beam scanning may include an inspection sub-system configured to scan an electron beam across the surface of a sample. The inspection sub-system may include an electron beam source, a sample stage, a set of electron-optic elements, a detector assembly and a controller communicatively coupled to one or more portions of the inspection sub-system. The controller may assess one or more characteristics of one or more portions of an area of the sample for inspection and, responsive to the assessed one or more characteristics, adjust one or more scan parameters of the inspection sub-system.

公开(公告)号：US09696268B2

公开(公告)日：2017-07-04

申请号：US14919563

申请日：2015-10-21

Applicant: KLA-Tencor Corporation

Inventor： Harsh Sinha ,  Dmitry Spivak ,  Huina Xu ,  Hong Xiao ,  Rohit Bothra

IPC: G01N23/00 ,  G01N23/22 ,  G01N23/223 ,  G01T1/36 ,  G01N23/225 ,  H01J37/28 ,  H01J37/20

CPC classification number: G01N23/2252 ,  H01J37/20 ,  H01J37/28 ,  H01J2237/22 ,  H01J2237/2806 ,  H01J2237/2807 ,  H01J2237/2817

Abstract: One embodiment relates to a method for automated review of defects detected in a defective die on the target substrate. The method includes: performing an automated review of the defects using an secondary electron microscope (SEM) so as to obtain electron-beam images of the defects; performing an automated classification of the defects into types based on morphology of the defects as determined from the electron-beam images; selecting defects of a specific type for automated energy-dispersive x-ray (EDX) review; and performing the automated EDX review on the defects of the specific type. In addition, automated techniques are disclosed for obtaining an accurate reference so as to improve the usefulness of the EDX results. Furthermore, an automated method of classifying the defects based on the EDX results is disclosed which provides a final pareto that combines both morphological and elemental information. Other embodiments, aspects and features are also disclosed.