公开(公告)号：US10763146B2

公开(公告)日：2020-09-01

申请号：US15751514

申请日：2017-12-11

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Michael Adel ,  Liran Yerushalmi ,  Eitan Herzel ,  Mengmeng Ye ,  Eran Amit

IPC: H01L21/67 ,  G01D18/00 ,  H01L21/66

Abstract: Metrology methods and modules are provided, which comprise carrying out recipe setup procedure(s) and/or metrology measurement(s) using zonal analysis with respect to respective setup parameter(s) and/or metrology metric(s). The zonal analysis comprises relating to spatially variable values of the setup parameter(s) and/or metrology metric(s) across one or more wafers in one or more lots. Wafer zones may be discrete or spatially continuous, and be used to weight one or more parameter(s) and/or metric(s) during any of the stages of the respective setup and measurement processes.