公开(公告)号：US11551980B2

公开(公告)日：2023-01-10

申请号：US16470886

申请日：2019-05-19

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Anna Golotsvan ,  Eyal Abend

IPC: H01L21/66 ,  H01L21/67 ,  G01B11/27

Abstract: A dynamic misregistration measurement amelioration method including taking at least one misregistration measurement at multiple sites on a first semiconductor device wafer, which is selected from a batch of semiconductor device wafers intended to be identical, analyzing each of the misregistration measurements, using data from the analysis of each of the misregistration measurements to determine ameliorated misregistration measurement parameters at each one of the multiple sites, thereafter ameliorating misregistration metrology tool setup for ameliorated misregistration measurement at the each one of the multiple sites, thereby generating an ameliorated misregistration metrology tool setup and thereafter measuring misregistration at multiple sites on a second semiconductor device wafer, which is selected from the batch of semiconductor device wafers intended to be identical, using the ameliorated misregistration metrology tool setup.

公开(公告)号：US20200286794A1

公开(公告)日：2020-09-10

申请号：US16470886

申请日：2019-05-19

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Anna Golotsvan ,  Eyal Abend

IPC: H01L21/66 ,  H01L21/67 ,  G01B11/27

Abstract: A dynamic misregistration measurement amelioration method including taking at least one misregistration measurement at multiple sites on a first semiconductor device wafer, which is selected from a batch of semiconductor device wafers intended to be identical, analyzing each of the misregistration measurements, using data from the analysis of each of the misregistration measurements to determine ameliorated misregistration measurement parameters at each one of the multiple sites, thereafter ameliorating misregistration metrology tool setup for ameliorated misregistration measurement at the each one of the multiple sites, thereby generating an ameliorated misregistration metrology tool setup and thereafter measuring misregistration at multiple sites on a second semiconductor device wafer, which is selected from the batch of semiconductor device wafers intended to be identical, using the ameliorated misregistration metrology tool setup.