Heat Removal From Substrates In Vacuum
    1.
    发明申请
    Heat Removal From Substrates In Vacuum 审中-公开
    从真空中的基板去除热

    公开(公告)号:US20130105108A1

    公开(公告)日:2013-05-02

    申请号:US13661146

    申请日:2012-10-26

    Abstract: Systems and methods to precisely balance the amount of heat removed from a specimen with the amount of heat generated during processing are presented. In some embodiments, the heat introduced into the specimen is rapidly removed by a temperature controlled cooling element via radiative heat transfer. In some embodiments, a heating element is disposed between the specimen and the cooling element. The heating element is controlled to precisely balance the amount of heat removed from the specimen with the amount of heat generated. A control signal is generated based on the amount of process energy known apriori. The control signal may also be based on an indication of a temperature of the specimen. In some embodiments, an adjustable aperture is employed to change the surface area of the cooling element exposed to the specimen, and thus control the amount of heat absorbed from the specimen by the cooling element.

    Abstract translation: 提出了精确平衡从样品中除去的热量与处理过程中产生的热量的系统和方法。 在一些实施例中,通过辐射热传递通过温度控制的冷却元件快速去除引入样品的热量。 在一些实施例中,加热元件设置在样品和冷却元件之间。 控制加热元件以精确地平衡从样品除去的热量与产生的热量。 基于已知的过程能量的量来生成控制信号。 控制信号也可以基于样本温度的指示。 在一些实施例中,采用可调节孔来改变暴露于样品的冷却元件的表面积,从而控制由冷却元件从样品吸收的热量。

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