公开(公告)号：US20190088514A1

公开(公告)日：2019-03-21

申请号：US15751514

申请日：2017-12-11

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie VOLKOVICH ,  Michael ADEL ,  Liran YERUSHALMI ,  Eitan HERZEL ,  Mengmeng YE ,  Eran AMIT

IPC: H01L21/67 ,  G01D18/00

Abstract: Metrology methods and modules are provided, which comprise carrying out recipe setup procedure(s) and/or metrology measurement(s) using zonal analysis with respect to respective setup parameter(s) and/or metrology metric(s). The zonal analysis comprises relating to spatially variable values of the setup parameter(s) and/or metrology metric(s) across one or more wafers in one or more lots. Wafer zones may be discrete or spatially continuous, and be used to weight one or more parameter(s) and/or metric(s) during any of the stages of the respective setup and measurement processes.