公开(公告)号：US20220199437A1

公开(公告)日：2022-06-23

申请号：US17688856

申请日：2022-03-07

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Renan Milo ,  Liran Yerushalmi ,  Moran Zaberchik ,  Yoel Feler ,  David Izraeli

IPC: H01L21/67 ,  G05B19/418

Abstract: A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misregistration indication, measuring misregistration between layers of a semiconductor device wafer at a second instance and providing a second misregistration indication, providing a misregistration measurement difference output in response to a difference between the first misregistration indication and the second misregistration indication, providing a baseline difference output and ameliorating the difference between the misregistration measurement difference output and the baseline difference output.

公开(公告)号：US20200312687A1

公开(公告)日：2020-10-01

申请号：US16467968

申请日：2019-05-06

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Renan Milo ,  Liran Yerushalmi ,  Moran Zaberchik ,  Yoel Feler ,  David Izraeli

IPC: H01L21/67 ,  G05B19/418

Abstract: A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misregistration indication, measuring misregistration between layers of a semiconductor device wafer at a second instance and providing a second misregistration indication, providing a misregistration measurement difference output in response to a difference between the first misregistration indication and the second misregistration indication, providing a baseline difference output and ameliorating the difference between the misregistration measurement difference output and the baseline difference output.

公开(公告)号：US11302544B2

公开(公告)日：2022-04-12

申请号：US16467968

申请日：2019-05-06

Applicant: KLA-TENCOR CORPORATION

Inventor： Roie Volkovich ,  Renan Milo ,  Liran Yerushalmi ,  Moran Zaberchik ,  Yoel Feler ,  David Izraeli

IPC: H01L21/67 ,  G05B19/418

Abstract: A method for measurement of misregistration in the manufacture of semiconductor device wafers, the method including measuring misregistration between layers of a semiconductor device wafer at a first instance and providing a first misregistration indication, measuring misregistration between layers of a semiconductor device wafer at a second instance and providing a second misregistration indication, providing a misregistration measurement difference output in response to a difference between the first misregistration indication and the second misregistration indication, providing a baseline difference output and ameliorating the difference between the misregistration measurement difference output and the baseline difference output.