公开(公告)号：US11049745B2

公开(公告)日：2021-06-29

申请号：US16417645

申请日：2019-05-21

Applicant: KLA-Tencor Corporation

Inventor： David Dowling ,  Tarunark Singh ,  Bjorn Brauer ,  Santosh Bhattacharyya ,  Bryant Mantiply ,  Hucheng Lee ,  Xiaochun Li ,  Sangbong Park

IPC: H01L21/67 ,  G06T7/00

Abstract: A method of semiconductor-wafer image alignment is performed at a semiconductor-wafer defect-inspection system. In the method, a semiconductor wafer is loaded into the semiconductor-wafer defect-inspection system. Pre-inspection alignment is performed for the semiconductor wafer. After performing the pre-inspection alignment, a first swath is executed to generate a first image of a first region on the semiconductor wafer. An offset of a target structure in the first image with respect to a known point is determined. Defect identification is performed for the first image, using the offset. After executing the first swath and determining the offset, a second swath is executed to generate a second image of a second region on the semiconductor wafer. While executing the second swath, run-time alignment of the semiconductor wafer is performed using the offset.