公开(公告)号：US10012599B2

公开(公告)日：2018-07-03

申请号：US15088081

申请日：2016-03-31

Applicant: KLA-Tencor Corporation

Inventor： Keith Wells ,  Xiaochun Li ,  Lisheng Gao ,  Tao Luo ,  Markus Huber

IPC: G01N21/95 ,  G06T7/00 ,  H01L21/67 ,  H01L21/66

CPC classification number: G01N21/9501 ,  G01N2201/061 ,  G01N2201/06113 ,  G01N2201/068 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L22/12

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

公开(公告)号：US20160290934A1

公开(公告)日：2016-10-06

申请号：US15088081

申请日：2016-03-31

Applicant: KLA-Tencor Corporation

Inventor： Keith Wells ,  Xiaochun Li ,  Lisheng Gao ,  Tao Luo ,  Markus Huber

IPC: G01N21/95 ,  H01L21/66 ,  G06T7/00 ,  H01L21/67

CPC classification number: G01N21/9501 ,  G01N2201/061 ,  G01N2201/06113 ,  G01N2201/068 ,  G06T7/0006 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/30148 ,  H01L21/67288 ,  H01L22/12

Abstract: Methods and systems for detecting defects on a wafer are provided. One system includes one or more computer subsystems configured for generating a rendered image based on information for a design printed on the wafer. The rendered image is a simulation of an image generated by the optical inspection subsystem for the design printed on the wafer. The computer subsystem(s) are also configured for comparing the rendered image to an optical image of the wafer generated by the optical inspection subsystem. The design is printed on the wafer using a reticle. In addition, the computer subsystem(s) are configured for detecting defects on the wafer based on results of the comparing.

Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一个系统包括被配置为基于印刷在晶片上的设计的信息来生成渲染图像的一个或多个计算机子系统。 渲染图像是由光学检查子系统为印刷在晶片上的设计产生的图像的模拟。 计算机子系统还被配置为将渲染图像与由光学检查子系统产生的晶片的光学图像进行比较。 该设计使用标线印在晶片上。 此外，计算机子系统被配置为基于比较的结果来检测晶片上的缺陷。